Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.56 |
| ▸ | MAPT | P10636 | 4/20 | 0.56 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.49 |
| ▸ | MEN1 | O00255 | 2/20 | 0.49 |
| ▸ | SMN1; SMN2 | Q16637 | 5/20 | 0.47 |
| ▸ | LMNA | P02545 | 1/20 | 0.46 |
| ▸ | GAA | P10253 | 2/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.45 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.45 |
| ▸ | NPC1 | O15118 | 4/20 | 0.44 |
| ▸ | RAB9A | P51151 | 4/20 | 0.44 |
| ▸ | CDK5 | Q00535 | 2/20 | 0.44 |
| ▸ | CDK5R1 | Q15078 | 2/20 | 0.44 |
| ▸ | PKM | P14618 | 1/20 | 0.44 |
| ▸ | TNF | P01375 | 1/20 | 0.43 |
| ▸ | KLF5 | Q13887 | 1/20 | 0.43 |
| ▸ | NOD1 | Q9Y239 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8408988 | 0.92 | MAPT (0.53) | ALDH1A1MAPTKMT2AMEN1SMN1; SMN2 | |
| SCHEMBL11077184 | 0.88 | MAPT (0.49) | ALDH1A1MAPTKMT2AMEN1SMN1; SMN2 | |
| SCHEMBL11077182 | 0.88 | MAPT (0.49) | ALDH1A1MAPTKMT2AMEN1SMN1; SMN2 | |
| SCHEMBL16336239 | 0.84 | CES2 (0.45) | ALDH1A1MAPTKMT2AMEN1SMN1; SMN2 | |
| SCHEMBL1126729 | 0.83 | ALDH1A1 (0.61) | ALDH1A1MAPTKMT2AMEN1SMN1; SMN2 | |
| SCHEMBL1968821 | 0.83 | ALDH1A1 (0.61) | ALDH1A1MAPTKMT2AMEN1SMN1; SMN2 | |
| SCHEMBL19663921 | 0.83 | ALDH1A1 (0.61) | ALDH1A1MAPTKMT2AMEN1SMN1; SMN2 | |
| SCHEMBL1348555 | 0.82 | NPC1 (0.54) | ALDH1A1MAPTKMT2ASMN1; SMN2LMNA | |
| SCHEMBL1346321 | 0.80 | KMT2A (0.62) | ALDH1A1MAPTKMT2AMEN1SMN1; SMN2 | |
| SCHEMBL12328528 | 0.80 | SMN1; SMN2 (0.53) | ALDH1A1MAPTKMT2AMEN1SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 417 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240166818-A1 | POLYIMIDES HAVING LOW DIELECTRIC LOSS | SOLVAY SPECIALTY POLYMERS ITALY S.P.A. (IT) | 2024-05-23 | — | — | US | claimed |
| US-20240150524-A1 | POLYIMIDES HAVING LOW DIELECTRIC LOSS | SOLVAY SPECIALTY POLYMERS ITALY S.P.A. (IT) | 2024-05-09 | — | — | US | claimed |
| EP-4294855-A1 | POLYIMIDES HAVING LOW DIELECTRIC LOSS | Solvay Specialty Polymers Italy S.p.A. (IT) | 2023-12-27 | — | — | EP | claimed |
| CN-116848177-A | Polyimide with low dielectric loss | 索尔维特殊聚合物意大利有限公司 | 2023-10-03 | — | — | CN | claimed |
| WO-2022175168-A1 | POLYIMIDES HAVING LOW DIELECTRIC LOSS | SOLVAY SPECIALTY POLYMERS ITALY S.P.A. (IT) | 2022-08-25 | — | — | WO | claimed |
| WO-2024147917-A1 | DIELECTRIC FILM FORMING COMPOSITION CONTAINING ACYL GERMANIUM COMPOUND | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2024-07-11 | — | — | WO | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| EP-3351602-B1 | LITHOGRAPHIC PRINTING INK, VARNISH FOR LITHOGRAPHIC INKS, AND METHOD FOR PRODUCING PRINTED MATTER USING SAID INK | TORAY INDUSTRIES (JP) | 2024-06-26 | — | — | EP | disclosed |
| US-20240198368-A1 | ELECTRODE COMPOSITION FOR ELECTROSPRAYING | AMOGREENTECH CO., LTD. (KR) | 2024-06-20 | — | — | US | disclosed |
| CN-118210196-A | Photosensitive resin composition, cured film pattern and method for producing the same | 奇美实业股份有限公司 | 2024-06-18 | — | — | CN | disclosed |
| US-20240166818-A1 | POLYIMIDES HAVING LOW DIELECTRIC LOSS | SOLVAY SPECIALTY POLYMERS ITALY S.P.A. (IT) | 2024-05-23 | — | — | US | disclosed |
| WO-2024095927-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | 旭化成株式会社 | 2024-05-10 | — | — | WO | disclosed |
| US-5310862-A | Photosensitive polyimide precursor compositions and process for preparing same | TORAY INDUSTRIES, INC. (JP) | 1994-05-10 | — | — | US | disclosed |
| WO-1994006057-A1 | POLYIMIDE PRECURSOR AND PHOTOSENSITIVE COMPOSITION CONTAINING THE SAME | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-03-17 | — | — | WO | disclosed |
| EP-0580108-A2 | A photosensitive polyimide composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-01-26 | — | — | EP | disclosed |
| EP-0571899-A1 | Radiation-curable mixture and its' use for producing high temperature-resistant relief structures | BASF Lacke + Farben Aktiengesellschaft (DE) | 1993-12-01 | — | — | EP | disclosed |
| US-5238784-A | PHOTOSENSITIVE RESIN COMPOSITION WITH POLYAMIC ACID POLYMER | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1993-08-24 | — | — | US | disclosed |
| EP-0531019-A1 | Photosensitive polyimide precursor compositions and process for preparing same | TORAY INDUSTRIES, INC. (JP) | 1993-03-10 | — | — | EP | disclosed |
| EP-0430221-A2 | Photosensitive resin composition | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |
| EP-0430220-A2 | Photosensitive resin composition and semiconductor apparatus using it | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |