Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | USP18 | Q9UMW8 | 1/20 | 0.54 |
| ▸ | UCHL5 | Q9Y5K5 | 1/20 | 0.54 |
| ▸ | ALDH1A1 | P00352 | 9/20 | 0.49 |
| ▸ | ALDH3A1 | P30838 | 1/20 | 0.49 |
| ▸ | ALDH1A3 | P47895 | 1/20 | 0.49 |
| ▸ | FGFR1 | P11362 | 1/20 | 0.47 |
| ▸ | MAOB | P27338 | 2/20 | 0.47 |
| ▸ | MEN1 | O00255 | 8/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 8/20 | 0.47 |
| ▸ | MAPT | P10636 | 5/20 | 0.47 |
| ▸ | LMNA | P02545 | 3/20 | 0.47 |
| ▸ | GSK3B | P49841 | 1/20 | 0.47 |
| ▸ | HPGD | P15428 | 3/20 | 0.46 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.46 |
| ▸ | CRHBP | P24387 | 1/20 | 0.46 |
| ▸ | CRHR2 | Q13324 | 1/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.46 |
| ▸ | GAA | P10253 | 3/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.46 |
| ▸ | NTSR1 | P30989 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1347928 | 1.00 | USP18 (0.54) | USP18UCHL5ALDH1A1ALDH3A1ALDH1A3 | |
| SCHEMBL2775363 | 0.87 | MAPT (0.56) | ALDH1A1ALDH3A1ALDH1A3FGFR1MAOB | |
| SCHEMBL355427 | 0.87 | MAPT (0.56) | ALDH1A1ALDH3A1ALDH1A3FGFR1MAOB | |
| SCHEMBL9661326 | 0.86 | ALDH1A1 (0.46) | ALDH1A1ALDH3A1ALDH1A3FGFR1MAOB | |
| SCHEMBL10979146 | 0.85 | ALDH1A1 (0.53) | ALDH1A1ALDH3A1ALDH1A3FGFR1MAOB | |
| SCHEMBL10979150 | 0.85 | ALDH1A1 (0.53) | ALDH1A1ALDH3A1ALDH1A3FGFR1MAOB | |
| SCHEMBL1348301 | 0.85 | F2 (0.56) | ALDH1A1ALDH3A1ALDH1A3FGFR1MAOB | |
| SCHEMBL1348304 | 0.85 | F2 (0.56) | ALDH1A1ALDH3A1ALDH1A3FGFR1MAOB | |
| SCHEMBL1349468 | 0.83 | CYP1A2 (0.64) | USP18UCHL5ALDH1A1MAOBMEN1 | |
| SCHEMBL1349466 | 0.83 | CYP1A2 (0.64) | USP18UCHL5ALDH1A1MAOBMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8063245-B2 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2011-11-22 | — | — | US | disclosed |
| US-20100218984-A1 | PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD | KANEKA CORPORATION (JP) | 2010-09-02 | — | — | US | disclosed |
| US-7189488-B2 | Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor | KANEKA CORPORATION (JP) | 2007-03-13 | — | — | US | disclosed |
| US-7141614-B2 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2006-11-28 | — | — | US | disclosed |
| US-20060199920-A1 | Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof | KANEKA CORPORATION (JP) | 2006-09-07 | — | — | US | disclosed |
| US-20060142542-A1 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2006-06-29 | — | — | US | disclosed |
| US-20040265731-A1 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2004-12-30 | — | — | US | disclosed |
| EP-0814109-B1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL CO LTD (JP) | 2004-08-18 | — | — | EP | disclosed |
| US-20040048978-A1 | Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board | KANEKA CORPORATION (JP) | 2004-03-11 | — | — | US | disclosed |
| US-20030149142-A1 | Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor | KANEKA CORPORATION | 2003-08-07 | — | — | US | disclosed |
| US-20020048726-A1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-04-25 | — | — | US | disclosed |
| US-6319656-B1 | FORMING FILM OF A NEGATIVE-WORKING PHOTO-SENSITIVE POLYIMIDE PRECURSOR ON A SUBSTRATE; EXPOSING FILM TO LIGHT THROUGH A MASK HAVING A PREDETERMINED PATTERN; DEVELOPING THE EXPOSED FILM USING AN ALKALINE AQUEOUS SOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-11-20 | — | — | US | disclosed |
| US-6200831-B1 | HEAT-CURING A COATING OF A POLYAMIC ACID BASED ON A TETRACARBOXYLIC ACID AND A DIAMINE CONTAINNG AN ACTIVE OXYGEN OR NITROGEN FUNCTIONAL GROUP; SEALING THE EXTERNAL TERMINALS WITH A RESIN, E.G. AN EPOXIDE | HITACHI, LTD. (JP) | 2001-03-13 | — | — | US | disclosed |
| US-6087006-A | SEMICONDUCTOR DEVICE HAVING SURFACE-PROTECTING FILM COMPRISING POLYIMIDE OBTAINED BY HEAT-CURING PRECURSOR HAVING POLAR SUBSTITUENTS AS THE SIDE CHAINS | HITACHI, LTD. (JP) | 2000-07-11 | — | — | US | disclosed |
| US-6025113-A | FOR PREPARING HIGHLY SENSITIVE NEGATIVE-WORKING PHOTOSENSITIVE MATERIAL DEVELOPABLE WITH ALKALINE AQUEOUS SOLUTION IN SHORT TIME WITH HIGH RESOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-15 | — | — | US | disclosed |
| EP-0814109-A1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1997-12-29 | — | — | EP | disclosed |