SCHEMBL2775363

SCHEMBL2775363

CCN(CC)c1ccc(/C=C2/CC(C)C/C(=C\c3ccc(N(CC)CC)cc3)C2=O)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 9/20 0.56
▸ MAPK1 P28482 6/20 0.56
▸ NPC1 O15118 4/20 0.56
▸ RAB9A P51151 4/20 0.56
▸ HTT P42858 3/20 0.56
▸ HSP90AA1 P07900 1/20 0.56
▸ ALDH1A1 P00352 9/20 0.50
▸ ALDH3A1 P30838 1/20 0.50
▸ ALDH1A3 P47895 1/20 0.50
▸ MEN1 O00255 10/20 0.48
▸ KMT2A Q03164 10/20 0.48
▸ LMNA P02545 6/20 0.48
▸ GSK3B P49841 1/20 0.48
▸ MITF O75030 1/20 0.48
▸ NSD2 O96028 1/20 0.48
▸ ATM Q13315 1/20 0.48
▸ HPGD P15428 3/20 0.47
▸ NPSR1 Q6W5P4 2/20 0.47
▸ CRHBP P24387 1/20 0.47
▸ CRHR2 Q13324 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL355427 1.00 MAPT (0.56) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL27854449 0.90 ALDH1A1 (0.49) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL10977914 0.88 MAPT (0.54) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL10977916 0.88 MAPT (0.54) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL1347928 0.87 USP18 (0.54) MAPTMAPK1NPC1RAB9AALDH1A1
SCHEMBL10979150 0.87 ALDH1A1 (0.53) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL1347925 0.87 USP18 (0.54) MAPTMAPK1NPC1RAB9AALDH1A1
SCHEMBL10979146 0.87 ALDH1A1 (0.53) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL9661326 0.84 ALDH1A1 (0.46) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL10985151 0.84 ALDH1A1 (0.46) MAPTMAPK1NPC1RAB9AHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8399176-B2 Photosensitive resin composition LG CHEM, LTD. (KR) 2013-03-19 — — US claimed
US-20100216073-A1 PHOTOSENSITIVE RESIN COMPOSITION LG CHEM, LTD. (KR) 2010-08-26 — — US claimed
EP-0068808-B1 PHOTORESIST COMPOSITION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1985-06-05 — — EP claimed
EP-0068808-A2 Photoresist composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1983-01-05 — — EP claimed
US-11640112-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-05-02 — — US disclosed
US-20220011669-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2022-01-13 — — US disclosed
US-11174401-B2 UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby LG CHEM, LTD. (KR) 2021-11-16 — — US disclosed
US-10414926-B2 UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby LG CHEM, LTD. (KR) 2019-09-17 — — US disclosed
US-10414925-B2 UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby LG CHEM, LTD. (KR) 2019-09-17 — — US disclosed
US-10358565-B2 UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby LG CHEM, LTD. (KR) 2019-07-23 — — US disclosed
US-10259957-B2 UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby LG CHEM, LTD. (KR) 2019-04-16 — — US disclosed
US-10227498-B2 UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby LG CHEM, LTD. (KR) 2019-03-12 — — US disclosed
US-5914354-A POLYIMIDE PRECURSOR, TERTIARY AMINE, PHOTOPOLYMERIZATION INITIATOR, SENSITIZER; THICK FILMS SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-06-22 — — US disclosed
US-5616448-A Photosensitive resin composition and a process for forming a patterned polyimide film using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-04-01 — — US disclosed
EP-0580108-B1 A photosensitive polyimide composition ASAHI CHEMICAL IND (JP) 1997-03-12 — — EP disclosed
US-5587275-A POLYAMIC ACIDS COMPRISING DIAMINES WITH AN ACRYLOXY OR A METHACRYLOXY GROUP; STORAGE STABILITY SHIN-ETSU CHEMICAL CO., LTD. (JP) 1996-12-24 — — US disclosed
EP-0718696-A2 A photosensitive polyimide composition ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1996-06-26 — — EP disclosed
EP-0580108-A2 A photosensitive polyimide composition ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1994-01-26 — — EP disclosed
EP-0068808-B1 PHOTORESIST COMPOSITION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1985-06-05 — — EP disclosed
EP-0068808-A2 Photoresist composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1983-01-05 — — EP disclosed
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