SCHEMBL355427

SCHEMBL355427

CCN(CC)c1ccc(C=C2CC(C)CC(=Cc3ccc(N(CC)CC)cc3)C2=O)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 9/20 0.56
MAPK1 P28482 6/20 0.56
NPC1 O15118 4/20 0.56
RAB9A P51151 4/20 0.56
HTT P42858 3/20 0.56
HSP90AA1 P07900 1/20 0.56
ALDH1A1 P00352 9/20 0.50
ALDH3A1 P30838 1/20 0.50
ALDH1A3 P47895 1/20 0.50
MEN1 O00255 10/20 0.48
KMT2A Q03164 10/20 0.48
LMNA P02545 6/20 0.48
GSK3B P49841 1/20 0.48
MITF O75030 1/20 0.48
NSD2 O96028 1/20 0.48
ATM Q13315 1/20 0.48
HPGD P15428 3/20 0.47
NPSR1 Q6W5P4 2/20 0.47
CRHBP P24387 1/20 0.47
CRHR2 Q13324 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2775363 1.00 MAPT (0.56) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL27854449 0.90 ALDH1A1 (0.49) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL10977914 0.88 MAPT (0.54) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL10977916 0.88 MAPT (0.54) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL1347925 0.87 USP18 (0.54) MAPTMAPK1NPC1RAB9AALDH1A1
SCHEMBL1347928 0.87 USP18 (0.54) MAPTMAPK1NPC1RAB9AALDH1A1
SCHEMBL10979150 0.87 ALDH1A1 (0.53) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL10979146 0.87 ALDH1A1 (0.53) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL9661326 0.84 ALDH1A1 (0.46) MAPTMAPK1NPC1RAB9AHTT
SCHEMBL10985151 0.84 ALDH1A1 (0.46) MAPTMAPK1NPC1RAB9AHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 412 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117384378-A Photosensitive polyamic acid ester resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2024-01-12 CN claimed
CN-115160569-B Photosensitive polyamic acid ester resin, resin composition and electronic component 明士(北京)新材料开发有限公司 2022-12-27 CN claimed
CN-115160569-A Photosensitive polyamic acid ester resin, resin composition and electronic component 明士(北京)新材料开发有限公司 2022-10-11 CN claimed
US-8399176-B2 Photosensitive resin composition LG CHEM, LTD. (KR) 2013-03-19 US claimed
US-20100216073-A1 PHOTOSENSITIVE RESIN COMPOSITION LG CHEM, LTD. (KR) 2010-08-26 US claimed
EP-0068808-B1 PHOTORESIST COMPOSITION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1985-06-05 EP claimed
US-4407927-A ANTIHALATION AGENT JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1983-10-04 US claimed
EP-0068808-A2 Photoresist composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1983-01-05 EP claimed
WO-2026100508-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2026-05-15 WO disclosed
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-03-05 US disclosed
US-4778859-A Tetramine derived polyimide with pendant unsaturation, and various photosensitive compositions therefrom ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1988-10-18 US disclosed
EP-0254230-A2 Heat-resistant photoresist film Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1988-01-27 EP disclosed
EP-0203393-A1 Curable composition Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1986-12-03 EP disclosed
EP-0068808-B1 PHOTORESIST COMPOSITION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1985-06-05 EP disclosed
US-4407927-A ANTIHALATION AGENT JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1983-10-04 US disclosed
EP-0068808-A2 Photoresist composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1983-01-05 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 MAPT 2839/4885MAPK1 2987/4885NPC1 3970/4885
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR MAPT 1027/4885MAPK1 3534/4885NPC1 3608/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 MAPT 1037/4885MAPK1 1924/4885NPC1 3340/4885
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ARCN1, PBRM1, LCP1 MAPT 950/4885MAPK1 3470/4885NPC1 4173/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.