SCHEMBL1348416

SCHEMBL1348416

CC(C)(C)c1c(C(=O)OO)ccc(C(=O)OO)c1C(=O)OO

nearest known ligand 0.33

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 1/20 0.33
MAPT P10636 2/20 0.31
POLB P06746 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
TDP1 Q9NUW8 1/20 0.30
ELANE P08246 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11177188 0.88 MAPT (0.34) KMT2AMAPTPOLBNPSR1TDP1
SCHEMBL316065 0.87 POLB (0.35) KMT2AMAPTPOLBTDP1
SCHEMBL122561 0.87 POLB (0.38) KMT2AMAPTPOLBTDP1
SCHEMBL1348680 0.82 POLB (0.32) KMT2AMAPTPOLB
SCHEMBL122563 0.81 GLRA3 (0.40) MAPTPOLBTDP1
SCHEMBL11216809 0.81 TDP1 (0.40) MAPTPOLBTDP1
SCHEMBL1348862 0.80 MAPT (0.39) KMT2AMAPTPOLBNPSR1TDP1
SCHEMBL1679222 0.80 MAPT (0.41) KMT2AMAPTPOLBNPSR1TDP1
SCHEMBL122560 0.78 GLRA3 (0.40) MAPTPOLBTDP1
SCHEMBL382358 0.78 GLRA3 (0.36) MAPTPOLBTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8063245-B2 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2011-11-22 US disclosed
US-20100218984-A1 PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD KANEKA CORPORATION (JP) 2010-09-02 US disclosed
US-20060199920-A1 Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof KANEKA CORPORATION (JP) 2006-09-07 US disclosed
US-20060142542-A1 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2006-06-29 US disclosed