SCHEMBL1348624

SCHEMBL1348624

Cc1cc(N)c(O)c(Cc2cc(C)cc(Cc3cc(C)cc(N)c3O)c2O)c1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AMY1A P0DUB6 1/20 0.57
ALDH1A1 P00352 8/20 0.56
KDM4E B2RXH2 1/20 0.56
LMNA P02545 1/20 0.56
GAA P10253 1/20 0.56
MAPT P10636 1/20 0.56
HIF1A Q16665 4/20 0.55
CYP2C9 P11712 3/20 0.55
CYP2C19 P33261 3/20 0.55
SMN1; SMN2 Q16637 3/20 0.55
HSPA5 P11021 2/20 0.52
HSD17B10 Q99714 3/20 0.44
CYP2D6 P10635 1/20 0.44
ALOX15 P16050 3/20 0.40
CYP1A2 P05177 1/20 0.40
CASP7 P55210 1/20 0.40
SELL P14151 1/20 0.37
SELP P16109 1/20 0.37
SELE P16581 1/20 0.37
TSHR P16473 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1347873 0.98 ALDH1A1 (0.58) AMY1AALDH1A1KDM4ELMNAGAA
SCHEMBL9663590 0.83 ALDH1A1 (0.56) AMY1AALDH1A1KDM4ELMNAGAA
SCHEMBL14303046 0.81 BCL2 (0.48) AMY1AALDH1A1KDM4ELMNAGAA
SCHEMBL14163474 0.78 ALDH1A1 (0.75) ALDH1A1KDM4ELMNAGAAMAPT
SCHEMBL23339864 0.77 AMY1A (0.67) AMY1AALDH1A1KDM4EGAAMAPT
SCHEMBL210506 0.77 AMY1A (0.61) AMY1AALDH1A1KDM4ELMNAGAA
SCHEMBL1482608 0.77 AMY1A (0.61) AMY1AALDH1A1KDM4ELMNAGAA
SCHEMBL30669854 0.77 AMY1A (0.61) AMY1AALDH1A1KDM4ELMNAGAA
SCHEMBL4456468 0.77 AMY1A (0.61) AMY1AALDH1A1KDM4ELMNAGAA
SCHEMBL12430315 0.77 AMY1A (0.61) AMY1AALDH1A1GAAHIF1ACYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120133061-A1 PHOTOSENSITIVE ADHESIVE, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE, WHICH ARE MADE USING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-05-31 US disclosed
US-8063245-B2 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2011-11-22 US disclosed
US-20100218984-A1 PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD KANEKA CORPORATION (JP) 2010-09-02 US disclosed
US-20100218984-A1 PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD KANEKA CORPORATION (JP) 2010-09-02 US disclosed
US-20100218984-A1 PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD KANEKA CORPORATION (JP) 2010-09-02 US disclosed
US-20060199920-A1 Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof KANEKA CORPORATION (JP) 2006-09-07 US disclosed
US-20060142542-A1 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2006-06-29 US disclosed