SCHEMBL210506

SCHEMBL210506

Cc1cc(CO)c(O)c(Cc2cc(C)cc(CO)c2O)c1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AMY1A P0DUB6 1/20 0.61
CYP2C9 P11712 3/20 0.59
CYP2C19 P33261 3/20 0.59
HIF1A Q16665 3/20 0.59
SMN1; SMN2 Q16637 2/20 0.59
HSPA5 P11021 2/20 0.55
SHBG P04278 1/20 0.52
HSD17B10 Q99714 2/20 0.47
CYP2D6 P10635 1/20 0.47
SELL P14151 1/20 0.40
SELP P16109 1/20 0.40
SELE P16581 1/20 0.40
KDM4E B2RXH2 3/20 0.39
CASP6 P55212 1/20 0.39
ALDH1A1 P00352 4/20 0.36
HPGD P15428 1/20 0.36
ACHE P22303 1/20 0.35
CA2 P00918 1/20 0.34
POLB P06746 1/20 0.34
TYR P14679 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1482608 1.00 AMY1A (0.61) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL29400422 1.00 AMY1A (0.61) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL187792 0.93 SHBG (0.52) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL8733376 0.92 SHBG (0.60) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL15344722 0.92 SHBG (0.55) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL26249010 0.92 AMY1A (0.53) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL18287641 0.92 AMY1A (0.58) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL19445265 0.92 AMY1A (0.58) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL26551024 0.90 AMY1A (0.52) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL23225945 0.87 SHBG (0.55) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 478 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1806618-B1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORP (JP) 2010-06-09 EP claimed
EP-0997777-B1 Photosensitive polymer composition, method for forming relief patterns, and electronic parts HITACHI CHEM DUPONT MICROSYS (JP) 2003-06-04 EP claimed
US-6514658-B2 Polyimide or precursor thereof soluble in alkaline solution, a photosensitive acid generator, and a compound having a phenolic hydroxyl group; positive-type, heat resistance HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2003-02-04 US claimed
US-6329110-B1 POSITIVES, POLYIMIDE SOLUBLE IN AN AQUEOUS ALKALINE SOLUTION; QUINONEDIAZIDE CAPABLE OF GENERATING AN ACID WHEN EXPOSED TO LIGHT; COMPOUND HAVING A PHENOLIC HYDROXYL GROUP; HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2001-12-11 US claimed
US-20010031419-A1 Photosensitive polymer composition, method for forming relief patterns, and electronic parts NUNOMURA MASATAKA (JP) 2001-10-18 US claimed
EP-0997777-A1 Photosensitive polymer composition, method for forming relief patterns, and electronic parts Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2000-05-03 EP claimed
US-4621123-A Phosphinylmethyl polypenols and polyglycidyl ethers thereof SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1986-11-04 US claimed
JP-9227432-A None JP disclosed
WO-2026105628-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 日産化学株式会社 2026-05-21 WO disclosed
WO-2026105630-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 日産化学株式会社 2026-05-21 WO disclosed
US-20260118765-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2026-04-30 US disclosed
US-12601972-B2 Resist underlayer film-forming composition with suppressed degeneration of crosslinking agent NISSAN CHEMICAL CORPORATION (JP) 2026-04-14 US disclosed
EP-4692943-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION Nissan Chemical Corporation (JP) 2026-02-11 EP disclosed
JP-H09227432-A NEW TETRAKISPHENOL COMPOUND HONSHU CHEM IND CO LTD 1997-09-02 JP disclosed
EP-0769485-A1 Positive resist composition and photosensitizers SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1997-04-23 EP disclosed
US-5235022-A Radiation sensitive; positive-working photoresists OCG MICROELECTRONIC MATERIALS, INC. (US) 1993-08-10 US disclosed
US-5234795-A Blocked novolak copolymer OCG MICROELECTRONIC MATERIALS, INC. (US) 1993-08-10 US disclosed
US-5232819-A Coating a substrate with a mixture of a radiation sensitive O-quinonediazide and a phenolic resin binder, imagewise exposure to radiation and developing to form a positive pattern in the coating OCG MICROELECTRONIC MATERIALS, INC. (US) 1993-08-03 US disclosed
US-5196289-A With o-quinonediazide OCG MICROELECTRONIC MATERIALS, INC. (US) 1993-03-23 US disclosed
US-4621123-A Phosphinylmethyl polypenols and polyglycidyl ethers thereof SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1986-11-04 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260118765-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION ASH2L, ASIC1, RPA1 AMY1A 389/4885CYP2C9 3645/4885CYP2C19 3194/4885
US-12601972-B2 Resist underlayer film-forming composition with suppressed degeneration of crosslinking agent BHMT, AADAT, PNMT AMY1A 555/4885CYP2C9 2530/4885CYP2C19 2230/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.