SCHEMBL13609970

SCHEMBL13609970

CC(=O)c1cc(C(C)(C)c2cc(C(C)(C)c3ccc(O)c(C(C)=O)c3)c(O)cc2O)ccc1O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ESR1 P03372 1/20 0.43
▸ HSP90AA1 P07900 1/20 0.42
▸ HSP90AB1 P08238 1/20 0.42
▸ PLG P00747 2/20 0.39
▸ KLK1 P06870 2/20 0.39
▸ KLK6 Q92876 2/20 0.39
▸ KLKB1 P03952 1/20 0.39
▸ KLF10 Q13118 1/20 0.39
▸ HPGD P15428 4/20 0.37
▸ ALOX15 P16050 3/20 0.37
▸ ALDH1A1 P00352 3/20 0.37
▸ SMN1; SMN2 Q16637 3/20 0.37
▸ TDP1 Q9NUW8 2/20 0.37
▸ MAPT P10636 2/20 0.37
▸ MAPK1 P28482 2/20 0.37
▸ ALOX12 P18054 1/20 0.37
▸ GAA P10253 1/20 0.37
▸ L3MBTL1 Q9Y468 1/20 0.37
▸ HSD17B10 Q99714 1/20 0.36
▸ HTT P42858 3/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13609958 0.86 ESR1 (0.53) ESR1HSP90AA1HSP90AB1PLGKLK1
SCHEMBL13609971 0.83 CA12 (0.54) ESR1HSP90AA1HSP90AB1HPGDSMN1; SMN2
SCHEMBL14301487 0.81 ESR1 (0.55) ESR1HSP90AA1HSP90AB1PLGKLK1
SCHEMBL6581882 0.80 HSP90AA1 (0.60) HSP90AA1HSP90AB1PLGKLK1KLK6
SCHEMBL11653228 0.80 ESR1 (0.52) ESR1HSP90AA1HSP90AB1KLF10HPGD
SCHEMBL31240951 0.80 ESR1 (0.52) ESR1HSP90AA1HSP90AB1KLF10HPGD
SCHEMBL13609968 0.77 ESR1 (0.73) ESR1KLF10HPGDALOX15ALDH1A1
SCHEMBL13135102 0.76 ALDH1A1 (0.53) ESR1HSP90AA1HSP90AB1KLF10HPGD
SCHEMBL11552788 0.76 HSP90AA1 (0.44) HSP90AA1HSP90AB1PLGKLK1KLK6
SCHEMBL320481 0.75 CES2 (0.52) HPGDALDH1A1MAPTL3MBTL1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7615331-B2 Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device FUJIFILM CORPORATION (JP) 2009-11-10 — — US disclosed
US-7615331-B2 Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device FUJIFILM CORPORATION (JP) 2009-11-10 — — US disclosed
US-20080081294-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED RELIEF PATTERN USING THE SAME AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-04-03 — — US disclosed
US-20080081294-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED RELIEF PATTERN USING THE SAME AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-04-03 — — US disclosed
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