SCHEMBL1373567

SCHEMBL1373567

O=C(OCC1CO1)c1ccc2ccccc2c1C(=O)O

nearest known ligand 0.51

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
DHFR P00374 1/20 0.49
MGLL Q99685 4/20 0.43
WDR5 P61964 1/20 0.41
LDHA P00338 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29678730 0.92 DHFR (0.51) DHFRMGLL
SCHEMBL471853 0.92 DHFR (0.51) DHFRMGLL
SCHEMBL23466923 0.82 DHFR (0.54) DHFRMGLL
SCHEMBL9153659 0.82 DHFR (0.60) DHFRMGLL
SCHEMBL29763757 0.82 DHFR (0.44) DHFRMGLL
SCHEMBL22357200 0.82 DHFR (0.49) DHFRMGLL
SCHEMBL1715144 0.82 DHFR (0.59) DHFRMGLL
SCHEMBL31530692 0.82 DHFR (0.59) DHFRMGLL
SCHEMBL1714910 0.81 DHFR (0.46) DHFRMGLL
SCHEMBL3082765 0.81 DHFR (0.49) DHFRMGLL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4674885-A1 POLYESTER, PRESSURE-SENSITIVE ADHESIVE AGENT COMPOSITION, PRESSURE-SENSITIVE ADHESIVE AGENT, PRESSURE-SENSITIVE ADHESIVE TAPE, AND PRESSURE-SENSITIVE ADHESIVE TAPE FOR ELECTRONIC MEMBERS Mitsubishi Chemical Corporation (JP) 2026-01-07 EP disclosed
US-20260001999-A1 HYDROPHILIC OIL REPELLENT POLYMER SUMITOMO CHEMICAL CO (JP) 2026-01-01 US disclosed
US-20250361356-A1 POLYESTER, ADHESIVE COMPOSITION, ADHESIVE, ADHESIVE TAPE, AND ADHESIVE TAPE FOR ELECTRONIC COMPONENTS MITSUBISHI CHEMICAL CORPORATION (JP) 2025-11-27 US disclosed
EP-4578895-A1 POLYMER, RESIN COMPOSITION, MOLDED BODY, AND POLYMER PRODUCTION METHOD Sumitomo Chemical Company, Limited (JP) 2025-07-02 EP disclosed
EP-4578894-A1 HYDROPHILIC OIL REPELLENT POLYMER Sumitomo Chemical Company, Limited (JP) 2025-07-02 EP disclosed
WO-2025079453-A1 INJECTION MOLDED BODY, METHOD FOR PRODUCING INJECTION MOLDED BODY, AND MACHINE キヤノン株式会社 2025-04-17 WO disclosed
WO-2025037599-A1 RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, PELLETS, MOLDED BODY, INJECTION MOLDED BODY, AND APPARATUS キヤノン株式会社 2025-02-20 WO disclosed
EP-4458920-A2 POLYESTER PRESSURE-SENSITIVE ADHESIVE COMPOSITION, POLYESTER PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE SHEET AND OPTICAL MEMBER WITH PRESSURE-SENSITIVE ADHESIVE LAYER Mitsubishi Chemical Corporation (JP) 2024-11-06 EP disclosed
US-12098312-B2 Polyester pressure-sensitive adhesive composition, polyester pressure-sensitive adhesive, pressure-sensitive adhesive sheet and optical member with pressure-sensitive adhesive layer MITSUBISHI CHEMICAL CORPORATION (JP) 2024-09-24 US disclosed
US-11760904-B2 Adhesive tape DIC CORPORATION (JP) 2023-09-19 US disclosed
CN-101523292-A Method for manufacturing semiconductor device using quadruple-layer laminate NISSAN CHEMICAL IND LTD (JP) 2009-09-02 CN disclosed
EP-1553138-B1 FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE RESIN COMPOSITION AND MOLDINGS TORAY INDUSTRIES (JP) 2009-03-11 EP disclosed
US-20090030132-A1 Resin Composition and Molded Article Composed of the Same TORAY INDUSTRIES, INC (JP) 2009-01-29 US disclosed
CN-101160549-A Composition comprising polymer having ethylene-dicarbonyl structure for use in forming anti-reflective coating for lithography NISSAN CHEMICAL IND LTD (JP) 2008-04-09 CN disclosed
EP-1903077-A1 RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING THE SAME TORAY INDUSTRIES, INC. (JP) 2008-03-26 EP disclosed
CN-101052919-A Sulfonate-containing composition for forming anti-reflective coating for lithography NISSAN CHEMICAL IND LTD (JP) 2007-10-10 CN disclosed
CN-1965268-A Antireflection film for semiconductor containing condensation type polymer NISSAN CHEMICAL IND LTD (JP) 2007-05-16 CN disclosed
US-7135509-B2 Suitable for machine component parts, electrical/electronic component parts, and automotive component parts, injection moldability, mechanical properties TORAY INDUSTRIES, INC. (JP) 2006-11-14 US disclosed
US-20060142438-A1 Flame-retardant polybutylene terephthalate resin composition and formed article TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2006-06-29 US disclosed
EP-1553138-A1 FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE RESIN COMPOSITION AND MOLDINGS TORAY INDUSTRIES, INC. (JP) 2005-07-13 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260001999-A1 HYDROPHILIC OIL REPELLENT POLYMER CCR1, H1-3, CCR3 DHFR 2992/4885MGLL 96/4885WDR5 1927/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.