Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM5A | P29375 | 4/20 | 0.48 |
| ▸ | CA12 | O43570 | 3/20 | 0.48 |
| ▸ | CA1 | P00915 | 3/20 | 0.48 |
| ▸ | CA9 | Q16790 | 3/20 | 0.48 |
| ▸ | PHF8 | Q9UPP1 | 2/20 | 0.45 |
| ▸ | KDM4C | Q9H3R0 | 2/20 | 0.45 |
| ▸ | DRD2 | P14416 | 1/20 | 0.42 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.42 |
| ▸ | DRD3 | P35462 | 1/20 | 0.42 |
| ▸ | OPRD1 | P41143 | 1/20 | 0.42 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | ALDH2 | P05091 | 1/20 | 0.42 |
| ▸ | TSHR | P16473 | 2/20 | 0.40 |
| ▸ | MEN1 | O00255 | 1/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.40 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.40 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | MAPT | P10636 | 1/20 | 0.39 |
| ▸ | MMP1 | P03956 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Peroxide SCHEMBL137833 | 1.00 | KDM5A (0.48) | KDM5ACA12CA1CA9PHF8 | |
| Methyl Alcohol SCHEMBL3078253 | 0.93 | CA12 (0.48) | KDM5ACA12CA1CA9PHF8 | |
| SCHEMBL27566038 | 0.93 | TSHR (0.46) | KDM5ACA12CA1CA9PHF8 | |
| SCHEMBL3904839 | 0.93 | TSHR (0.46) | KDM5ACA12CA1CA9PHF8 | |
| SCHEMBL896 | 0.93 | TSHR (0.46) | KDM5ACA12CA1CA9PHF8 | |
| Bicarbonate SCHEMBL5874857 | 0.91 | CA12 (0.54) | KDM5ACA12CA1CA9PHF8 | |
| Bicarbonate SCHEMBL5874864 | 0.91 | CA12 (0.54) | KDM5ACA12CA1CA9PHF8 | |
| SCHEMBL28809066 | 0.90 | CA12 (0.46) | KDM5ACA12CA1CA9PHF8 | |
| Alcohol SCHEMBL2290514 | 0.90 | CA12 (0.46) | KDM5ACA12CA1CA9PHF8 | |
| Hydrochloric Acid SCHEMBL180393 | 0.89 | DNM1 (0.45) | KDM5ACA12CA1CA9PHF8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107735854-B | Sinterable adhesive material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-12-15 | — | — | CN | disclosed |
| CN-107112246-B | Sinterable bonding material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-11-10 | — | — | CN | disclosed |
| EP-3708389-A1 | TIRE STUD AND MANUFACTURING METHOD THEREFOR | Moon, Dae Yong (KR) | 2020-09-16 | — | — | EP | disclosed |
| US-20200262249-A1 | TIRE STUD AND MANUFACTURING METHOD THEREFOR | MUN DAE YONG (KR) | 2020-08-20 | — | — | US | disclosed |
| US-10446518-B2 | Sinterable bonding material and semiconductor device using the same | HENKEL AG & CO. KGAA (DE) | 2019-10-15 | — | — | US | disclosed |
| US-10141283-B2 | Sinterable bonding material and semiconductor device using the same | HENKEL AG & CO. KGAA (DE) | 2018-11-27 | — | — | US | disclosed |
| CN-107735854-A | Sinterable jointing material and use its semiconductor device | 汉高股份有限及两合公司 | 2018-02-23 | — | — | CN | disclosed |
| EP-3238239-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | Henkel AG & Co. KGaA (DE) | 2017-11-01 | — | — | EP | disclosed |
| US-20170294396-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | HENKEL AG & CO. KGAA (DE) | 2017-10-12 | — | — | US | disclosed |
| US-20170294404-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | HENKEL AG & CO. KGAA (DE) | 2017-10-12 | — | — | US | disclosed |
| CN-107112246-A | Sinterable bonding material and semiconductor device using same | 汉高股份有限及两合公司 | 2017-08-29 | — | — | CN | disclosed |
| CN-102596486-B | Metal paste with oxidation agents | HERAEUS MATERIALS TECH GMBH | 2015-06-24 | — | — | CN | disclosed |
| US-8950652-B2 | Metal paste with oxidizing agents | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-02-10 | — | — | US | disclosed |
| US-20150021378-A1 | METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS | Heraeus Deutschland GmbH & Co. KG (DE) | 2015-01-22 | — | — | US | disclosed |
| US-8925789-B2 | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-01-06 | — | — | US | disclosed |
| CN-102386149-B | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECH GMBH | 2014-12-03 | — | — | CN | disclosed |
| CN-102596486-A | Metal paste with oxidation agents | HERAEUS MATERIALS TECH GMBH | 2012-07-18 | — | — | CN | disclosed |
| US-20120153011-A1 | METAL PASTE WITH OXIDIZING AGENTS | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-06-21 | — | — | US | disclosed |
| CN-102386149-A | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECH GMBH | 2012-03-21 | — | — | CN | disclosed |
| US-20120055978-A1 | Contacting Means and Method for Contacting Electrical Components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-03-08 | — | — | US | disclosed |