SCHEMBL13864166

SCHEMBL13864166

C=C1CC(=O)N(CCCCCCCCCCCCN2C(=O)CC(=C)C2=O)C1=O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.43
RECQL P46063 2/20 0.43
MEN1 O00255 2/20 0.43
KMT2A Q03164 2/20 0.43
KDM4E B2RXH2 1/20 0.43
USP2 O75604 1/20 0.43
POLB P06746 1/20 0.43
BLM P54132 1/20 0.43
FAAH O00519 2/20 0.38
MGLL Q99685 2/20 0.38
MAPK1 P28482 2/20 0.38
HSP90AA1 P07900 1/20 0.38
TLR9 Q9NR96 1/20 0.38
ALDH1A1 P00352 1/20 0.38
LMNA P02545 1/20 0.38
TP53 P04637 1/20 0.38
PKM P14618 1/20 0.38
HPGD P15428 1/20 0.38
XBP1 P17861 1/20 0.38
HTT P42858 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26797334 0.98 MAPT (0.41) MAPTRECQLMEN1KMT2AKDM4E
SCHEMBL406778 0.91 MGLL (0.47) MAPTRECQLMEN1KMT2AKDM4E
SCHEMBL18840672 0.91 MGLL (0.47) MAPTRECQLMEN1KMT2AKDM4E
SCHEMBL410345 0.91 MGLL (0.47) MAPTRECQLMEN1KMT2AKDM4E
SCHEMBL5970022 0.91 MGLL (0.47) MAPTRECQLMEN1KMT2AKDM4E
SCHEMBL6835923 0.89 MAPT (0.35) MAPTRECQLMEN1KMT2AKDM4E
SCHEMBL11136205 0.88 MGLL (0.44) MAPTRECQLMEN1KMT2AKDM4E
SCHEMBL409034 0.86 KDM4E (0.44) MAPTRECQLMEN1KMT2AKDM4E
SCHEMBL23430477 0.85 MAPT (0.35) MAPTRECQLMEN1KMT2AKDM4E
SCHEMBL13864176 0.82 MGLL (0.40) MAPTKDM4EFAAHMGLLALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11578202-B2 Liquid compression molding encapsulants HENKEL AG & CO. KGAA (DE) 2023-02-14 US disclosed
US-20210253844-A1 LIQUID COMPRESSION MOLDING ENCAPSULANTS HENKEL AG & CO. KGAA (DE) 2021-08-19 US disclosed
US-9865551-B2 Methods to control wafer warpage upon compression molding thereof and articles useful therefor Henkel IP & Holding GmbH (DE) 2018-01-09 US disclosed
US-20170322600-A1 COMPOSITIONS HAVING A MATRIX AND A HYDRATED SALT OF AN ACID AND A GROUP I OR II ELMENT OF THE PERIODIC TABLE DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH Henkel IP & Holding GmbH (DE) 2017-11-09 US disclosed
US-20170322600-A1 COMPOSITIONS HAVING A MATRIX AND A HYDRATED SALT OF AN ACID AND A GROUP I OR II ELMENT OF THE PERIODIC TABLE DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH Henkel IP & Holding GmbH (DE) 2017-11-09 US disclosed
US-20170183450-A1 CATIONICALLY CURABLE BENZOXAZINE COMPOSITIONS Henkel IP & Holding GmbH (DE) 2017-06-29 US disclosed
US-20170183450-A1 CATIONICALLY CURABLE BENZOXAZINE COMPOSITIONS Henkel IP & Holding GmbH (DE) 2017-06-29 US disclosed
US-20170131751-A1 COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIALS DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH HENKEL AG & CO. KGAA (DE) 2017-05-11 US disclosed
US-20170131751-A1 COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIALS DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH HENKEL AG & CO. KGAA (DE) 2017-05-11 US disclosed
US-20160079187-A1 METHODS TO CONTROL WAFER WARPAGE UPON COMPRESSION MOLDING THEREOF AND ARTICLES USEFUL THEREFOR HENKEL CORPORATION 2016-03-17 US disclosed
US-9263360-B2 Liquid compression molding encapsulants Henkel IP & Holding GmbH (DE) 2016-02-16 US disclosed
US-20150152260-A1 LIQUID COMPRESSION MODLING ENCAPSULANTS HENKEL CORPORATION 2015-06-04 US disclosed
US-20150152260-A1 LIQUID COMPRESSION MODLING ENCAPSULANTS HENKEL CORPORATION 2015-06-04 US disclosed
WO-2015013024-A1 METHODS TO CONTROL WAFER WARPAGE UPON COMPRESSION MOLDING THEREOF AND ARTICLES USEFUL THEREFOR Henkel IP & Holding GmbH (DE) 2015-01-29 WO disclosed
US-8847415-B1 Liquid compression molding encapsulants Henkel IP & Holding GmbH (DE) 2014-09-30 US disclosed
US-8847415-B1 Liquid compression molding encapsulants Henkel IP & Holding GmbH (DE) 2014-09-30 US disclosed
US-7537839-B1 Adhesive compositions free of metallic catalyst HENKEL CORPORATION (US) 2009-05-26 US disclosed
US-7537839-B1 Adhesive compositions free of metallic catalyst HENKEL CORPORATION (US) 2009-05-26 US disclosed
US-7271227-B1 Adhesive compositions free of metallic catalyst HENKEL CORPORATION (US) 2007-09-18 US disclosed
US-7271227-B1 Adhesive compositions free of metallic catalyst HENKEL CORPORATION (US) 2007-09-18 US disclosed