SCHEMBL1405933

SCHEMBL1405933

CCOCC[Si](OC)(OC)OC

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.39
LMNA P02545 1/20 0.34
TSHR P16473 1/20 0.32
HTT P42858 1/20 0.31
HPGD P15428 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6138643 0.85 LMNA (0.33) LMNA
SCHEMBL718857 0.84 LMNA (0.41) ALDH1A1LMNATSHRHPGDSMN1; SMN2
SCHEMBL6440852 0.81 LMNA (0.38) LMNA
SCHEMBL16746519 0.80 LMNA (0.42) ALDH1A1LMNATSHRHTTHPGD
SCHEMBL15475767 0.80 LMNA (0.38) ALDH1A1LMNATSHRHPGDSMN1; SMN2
SCHEMBL28357883 0.80 LMNA (0.38) ALDH1A1LMNATSHRHTTHPGD
SCHEMBL28428476 0.80 LMNA (0.38) ALDH1A1LMNATSHRHTTHPGD
SCHEMBL3222134 0.80 LMNA (0.38) ALDH1A1LMNATSHRHTTHPGD
SCHEMBL1741136 0.78 ALDH1A1 (0.39) ALDH1A1TSHR
Ether SCHEMBL1968374 0.78 LMNA (0.39) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112534019-B Adhesive composition using resin having imide bond and phosphorus compound 东洋纺株式会社 2022-11-25 CN disclosed
EP-1696000-B2 POLYESTER RESIN COMPOSITION AND MOLDED OBJECT KANEKA CORP (JP) 2014-10-15 EP disclosed
US-20110189476-A1 ORGANIZED CLAY COMPOSITE, METHOD FOR PRODUCING THE SAME, AND RESIN COMPOSITE CONTAINING ORGANIZED CLAY COMPOSITE SHOWA DENKO K.K. (JP) 2011-08-04 US disclosed
EP-1696000-B1 POLYESTER RESIN COMPOSITION AND MOLDED OBJECT KANEKA CORP (JP) 2011-03-09 EP disclosed
US-20100190908-A1 ORGANIZED CLAY, PROCESS FOR PRODUCING THE SAME, AND RESIN COMPOSITE CONTAINING ORGANIZED CLAY SHOWA DENKO K.K. (JP) 2010-07-29 US disclosed
EP-2186776-A1 ORGANIZED CLAY COMPLEX, METHOD FOR PRODUCING THE SAME, AND RESIN COMPLEX CONTAINING ORGANIZED CLAY COMPLEX Showa Denko K.K. (JP) 2010-05-19 EP disclosed
EP-1420049-B1 SURFACE-TREATED INORGANIC PARTICLES KANEKA CORP (JP) 2010-04-21 EP disclosed
EP-2172425-A1 ORGANIZED CLAY, PROCESS FOR PRODUCING THE SAME, AND RESIN COMPOSITE CONTAINING ORGANIZED CLAY Showa Dendo K.K. (JP) 2010-04-07 EP disclosed
US-20080167413-A1 Organic-inorganic composite composition, plastic substrate, gas barrier laminate film, and image display device NISHIMI TAISEI 2008-07-10 US disclosed
US-20080064824-A1 Polyester Resin Composition and Molded Object KANEKA CORPORATION (JP) 2008-03-13 US disclosed
EP-0899308-B1 THERMOPLASTIC RESIN COMPOSITION CONTAINING SILANE-TREATED FOLIATED PHYLLOSILICATE AND METHOD FOR PRODUCING THE SAME KANEKA CORP (JP) 2004-11-03 EP disclosed
US-20040197561-A1 Process for producing surface-treated inorganic particle and surface-treated inogranic particle KANEKA CORPORATION (JP) 2004-10-07 US disclosed
EP-1026203-B1 POLYESTER RESIN COMPOSITIONS AND PROCESSES FOR THE PREPARATION THEREOF KANEKA CORP (JP) 2004-09-08 EP disclosed
US-20040137227-A1 Polyester fiber KANEKA CORPORATION (JP) 2004-07-15 US disclosed
EP-1420049-A1 PROCESS FOR PRODUCING SURFACE−TREATED INORGANIC PARTICLE AND SURFACE−TREATED INORGANIC PARTICLE KANEKA CORPORATION (JP) 2004-05-19 EP disclosed
US-6583208-B1 Dispersion with organosilane-treated phyllosilicate KANEKA CORPORATION (JP) 2003-06-24 US disclosed
EP-1142954-A1 RESIN COMPOSITIONS AND PROCESS FOR PRODUCING THE SAME Kaneka Corporation (JP) 2001-10-10 EP disclosed
US-6239195-B1 INTRODUCING THE ORGANOSILANE COMPOUND INTO THE SWELLABLE LAYERED SILICATE AFTER THE BASAL SPACING OF THE SWELLABLE LAYERED SILICATE HAS BEEN EXPANDED, AND IS EXFOLIATED AS A NUMBER OF FINE LAYERS DISPERSED UNIFORMLY KANEKA CORPORATION (JP) 2001-05-29 US disclosed
EP-1026203-A1 POLYESTER RESIN COMPOSITIONS AND PROCESSES FOR THE PREPARATION THEREOF KANEKA CORPORATION (JP) 2000-08-09 EP disclosed
EP-0899308-A1 THERMOPLASTIC RESIN COMPOSITION CONTAINING CLAY COMPOSITE AND PROCESS FOR PREPARING THE SAME KANEKA CORPORATION (JP) 1999-03-03 EP disclosed