⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3416636 | 0.80 | — | — | |
| SCHEMBL8644822 | 0.80 | HSP90AA1 (0.32) | — | |
| SCHEMBL192561 | 0.73 | LMNA (0.35) | — | |
| SCHEMBL993109 | 0.73 | — | — | |
| SCHEMBL8935319 | 0.73 | — | — | |
| Ammonia Solution, Strong SCHEMBL1138722 | 0.71 | ALDH1A1 (0.31) | — | |
| Bromide SCHEMBL7178493 | 0.71 | — | — | |
| SCHEMBL21385109 | 0.71 | — | — | |
| Ammonia Solution, Strong SCHEMBL9538468 | 0.71 | ALDH1A1 (0.31) | — | |
| Hydrochloric Acid SCHEMBL546609 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7497966-B2 | Chemical mechanical polishing slurry composition for shallow trench isolation process of semiconductor | HANWHA CHEMICAL CORPORATION (KR) | 2009-03-03 | — | — | US | claimed |
| US-20070220813-A1 | Chemical Mechanical Polishing Slurry Composition for Shallow Trench Isolation Process of Semiconductor | HANWHA CHEMICAL CORPORATION (KR) | 2007-09-27 | — | — | US | claimed |
| WO-2006004258-A1 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION FOR SHALLOW TRENCH ISOLATION PROCESS OF SEMICONDUCTOR | HANWHA CHEMICAL CORPORATION (KR) | 2006-01-12 | — | — | WO | claimed |
| US-9365685-B2 | Method of improving adhesion of carbon fibers with a polymeric matrix | UT-BATTELLE, LLC (US) | 2016-06-14 | — | — | US | disclosed |
| US-20130224470-A1 | METHOD OF IMPROVING ADHESION OF CARBON FIBERS WITH A POLYMERIC MATRIX | UT-BATTELLE, LLC (US) | 2013-08-29 | — | — | US | disclosed |
| US-20110092699-A1 | PROCESS FOR PRODUCING AMIDE OR LACTAM | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2011-04-21 | — | — | US | disclosed |
| EP-2301918-A1 | PROCESS FOR PRODUCING AMIDE OR LACTAM | Daicel Chemical Industries, Ltd. (JP) | 2011-03-30 | — | — | EP | disclosed |
| US-7497966-B2 | Chemical mechanical polishing slurry composition for shallow trench isolation process of semiconductor | HANWHA CHEMICAL CORPORATION (KR) | 2009-03-03 | — | — | US | disclosed |
| US-20070220813-A1 | Chemical Mechanical Polishing Slurry Composition for Shallow Trench Isolation Process of Semiconductor | HANWHA CHEMICAL CORPORATION (KR) | 2007-09-27 | — | — | US | disclosed |
| WO-2006004258-A1 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION FOR SHALLOW TRENCH ISOLATION PROCESS OF SEMICONDUCTOR | HANWHA CHEMICAL CORPORATION (KR) | 2006-01-12 | — | — | WO | disclosed |