SCHEMBL14458252

SCHEMBL14458252

Cc1ccc(Oc2ccc(S(=O)(=O)c3ccc(Oc4ccc(-c5ccc(Oc6ccc(S(=O)(=O)c7ccc(Cl)cc7)cc6)cc5)cc4)cc3)cc2)cc1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.65
SMN1; SMN2 Q16637 1/20 0.65
L3MBTL1 Q9Y468 2/20 0.58
TDP1 Q9NUW8 1/20 0.58
NPSR1 Q6W5P4 1/20 0.54
ALDH1A1 P00352 3/20 0.53
CYP3A4 P08684 1/20 0.53
MAPK1 P28482 1/20 0.53
GAA P10253 1/20 0.53
KMT2A Q03164 2/20 0.47
POLB P06746 1/20 0.47
BCHE P06276 1/20 0.46
ACHE P22303 1/20 0.46
KDM4E B2RXH2 1/20 0.46
HPGD P15428 1/20 0.46
ALOX15 P16050 1/20 0.46
HSD17B10 Q99714 1/20 0.46
MEN1 O00255 1/20 0.46
PGR P06401 2/20 0.46
GRM5 P41594 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2696615 0.95 HTT (0.71) HTTSMN1; SMN2L3MBTL1TDP1NPSR1
SCHEMBL14458257 0.95 HTT (0.71) HTTSMN1; SMN2L3MBTL1TDP1NPSR1
SCHEMBL17247214 0.91 HTT (0.76) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL16621782 0.91 HTT (0.76) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL822844 0.91 HTT (0.76) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL23957972 0.91 HTT (0.76) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL12769542 0.91 HTT (0.76) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL822642 0.91 ALDH1A1 (0.64) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL18133333 0.89 ALDH1A1 (0.67) HTTSMN1; SMN2ALDH1A1CYP3A4MAPK1
SCHEMBL10084171 0.86 HTT (0.85) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7244778-B2 Filler reinforced polyether imide resin composition and molded article thereof GENERAL ELECTRIC COMPANY (US) 2007-07-17 US disclosed