SCHEMBL14458257

SCHEMBL14458257

Cc1ccc(Oc2ccc(S(=O)(=O)c3ccc(Cl)cc3)cc2)cc1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.71
SMN1; SMN2 Q16637 1/20 0.71
L3MBTL1 Q9Y468 2/20 0.63
TDP1 Q9NUW8 1/20 0.63
ALDH1A1 P00352 4/20 0.59
CYP3A4 P08684 1/20 0.59
MAPK1 P28482 1/20 0.59
GAA P10253 1/20 0.59
KMT2A Q03164 3/20 0.50
MEN1 O00255 2/20 0.50
BCHE P06276 1/20 0.50
ACHE P22303 1/20 0.50
POLB P06746 1/20 0.50
KDM4E B2RXH2 1/20 0.50
HPGD P15428 1/20 0.50
ALOX15 P16050 1/20 0.50
HSD17B10 Q99714 1/20 0.50
PGR P06401 2/20 0.49
PKM P14618 1/20 0.48
FFAR1 O14842 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2696615 1.00 HTT (0.71) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL14458252 0.95 HTT (0.65) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL822947 0.90 HTT (0.85) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL12268296 0.90 HTT (0.85) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL2606163 0.90 HTT (0.85) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL4569586 0.90 HTT (0.85) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL822843 0.90 HTT (0.85) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL10084171 0.90 HTT (0.85) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL4374736 0.90 ALDH1A1 (0.73) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1
SCHEMBL809432 0.90 ALDH1A1 (0.73) HTTSMN1; SMN2L3MBTL1TDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7244778-B2 Filler reinforced polyether imide resin composition and molded article thereof GENERAL ELECTRIC COMPANY (US) 2007-07-17 US disclosed