Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 12/20 | 0.70 |
| ▸ | ESR2 | Q92731 | 10/20 | 0.70 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.59 |
| ▸ | HPGD | P15428 | 3/20 | 0.59 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.59 |
| ▸ | LMNA | P02545 | 2/20 | 0.59 |
| ▸ | TYR | P14679 | 2/20 | 0.59 |
| ▸ | AR | P10275 | 1/20 | 0.59 |
| ▸ | TSHR | P16473 | 1/20 | 0.59 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.59 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.59 |
| ▸ | HTR6 | P50406 | 1/20 | 0.59 |
| ▸ | ESRRG | P62508 | 1/20 | 0.59 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.59 |
| ▸ | MEN1 | O00255 | 2/20 | 0.55 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.50 |
| ▸ | SHBG | P04278 | 1/20 | 0.48 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.46 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18750 | 0.92 | ESR1 (0.80) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| SCHEMBL22335854 | 0.92 | ESR1 (0.80) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| SCHEMBL4063477 | 0.92 | ESR1 (0.80) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| SCHEMBL23059478 | 0.91 | ESR1 (0.87) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| Phloroglucinol SCHEMBL28093041 | 0.90 | ESR1 (0.70) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| Methyl Alcohol SCHEMBL28048714 | 0.89 | ESR1 (0.76) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| SCHEMBL6761025 | 0.89 | ESR1 (0.76) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| SCHEMBL29771960 | 0.89 | ESR1 (0.57) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| SCHEMBL3681031 | 0.88 | ESR1 (0.73) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| SCHEMBL13609942 | 0.86 | ESR1 (0.59) | ESR1ESR2CYP3A4HPGDHSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 137 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4514334-A | Polyphenolic compounds | GENERAL ELECTRIC COMPANY (US) | 1985-04-30 | — | — | US | claimed |
| WO-2024150700-A1 | RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2024-07-18 | — | — | WO | disclosed |
| WO-2024143209-A1 | METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143212-A1 | METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143210-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143211-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024101295-A1 | PRODUCTION METHOD FOR CURED PRODUCT, PRODUCTION METHOD FOR LAMINATE, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-16 | — | — | WO | disclosed |
| WO-2024101266-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-16 | — | — | WO | disclosed |
| WO-2024095884-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-10 | — | — | WO | disclosed |
| WO-2024095885-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED OBJECT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED OBJECT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-10 | — | — | WO | disclosed |
| EP-0786699-A1 | Positive photoresist composition | Fuji Photo Film Co., Ltd. (JP) | 1997-07-30 | — | — | EP | disclosed |
| EP-0780239-A2 | Negative-working image recording material | FUJI PHOTO FILM CO., LTD. (JP) | 1997-06-25 | — | — | EP | disclosed |
| US-5620828-A | Positive photoresist composition containing quinonediazide esterification product, novolak resin and pocyhydroxy alkali dissolution accelerator | FUJI PHOTO FILM CO., LTD. (JP) | 1997-04-15 | — | — | US | disclosed |
| EP-0766139-A1 | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-04-02 | — | — | EP | disclosed |
| EP-0745575-A1 | Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound | FUJI PHOTO FILM CO., LTD. (JP) | 1996-12-04 | — | — | EP | disclosed |
| EP-0709736-A1 | Positive chemically amplified resist composition and method for producing compounds used therein | FUJI PHOTO FILM CO., LTD. (JP) | 1996-05-01 | — | — | EP | disclosed |
| EP-0708368-A1 | Positive-working photosensitive composition | FUJI PHOTO FILM CO., LTD. (JP) | 1996-04-24 | — | — | EP | disclosed |
| US-5340688-A | Containing mixture of 1,2-naphthoquinonediazidosulfonate esters of polyhydroxy compounds and alkali soluble resin | FUJI PHOTO FILM CO., LTD. (JP) | 1994-08-23 | — | — | US | disclosed |
| US-5318875-A | Resolution; heat resistance; photosensitivity; developability; integrated circuits; semiconductors | FUJI PHOTO FILM CO., LTD. (JP) | 1994-06-07 | — | — | US | disclosed |
| EP-0555861-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1993-08-18 | — | — | EP | disclosed |