SCHEMBL14715593

SCHEMBL14715593

CC(C)(C)C(=O)CC(=O)O.[Ag]

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LDHA P00338 1/20 0.44
SRR Q9GZT4 1/20 0.44
HMGCR P04035 1/20 0.39
CHRM1 P11229 1/20 0.39
TBXA2R P21731 1/20 0.39
ADRA1A P35348 1/20 0.39
KMT2A Q03164 1/20 0.38
TSHR P16473 3/20 0.38
CYP2D6 P10635 1/20 0.38
CYP2C19 P33261 1/20 0.38
HIF1A Q16665 1/20 0.38
FFAR3 O14843 2/20 0.35
KDM4E B2RXH2 2/20 0.35
HSD11B1 P28845 1/20 0.34
NAALAD2 Q9Y3Q0 1/20 0.33
ALDH1A1 P00352 1/20 0.33
FFAR1 O14842 1/20 0.33
CPT2 P23786 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
ALOX15 P16050 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL954279 0.97 LDHA (0.47) LDHASRRHMGCRCHRM1TBXA2R
SCHEMBL28121741 0.87 LDHA (0.38) LDHASRRHMGCRCHRM1TBXA2R
Nitrous Acid SCHEMBL27764796 0.87 LDHA (0.38) LDHASRRHMGCRCHRM1TBXA2R
Acetoacetic Acid SCHEMBL4622741 0.87 KDM4E (0.41) LDHASRRHMGCRCHRM1TBXA2R
SCHEMBL7165273 0.83 LDHA (0.40) LDHASRRHMGCRCHRM1TBXA2R
SCHEMBL93393 0.81 KMT2A (0.39) HMGCRCHRM1TBXA2RADRA1AKMT2A
SCHEMBL4837194 0.81 KMT2A (0.39) HMGCRCHRM1TBXA2RADRA1AKMT2A
SCHEMBL6910342 0.78 KMT2A (0.37) HMGCRCHRM1TBXA2RADRA1AKMT2A
SCHEMBL15788938 0.78 KMT2A (0.37) HMGCRCHRM1TBXA2RADRA1AKMT2A
SCHEMBL21405194 0.78 KMT2A (0.37) HMGCRCHRM1TBXA2RADRA1AKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10040960-B2 Silver ink composition, conductor and communication device TOPPAN FORMS CO., LTD. (JP) 2018-08-07 US claimed
US-9371465-B2 Silver ink composition TOPPAN FORMS CO., LTD. (JP) 2016-06-21 US claimed
US-20150259557-A1 SILVER INK COMPOSITION, CONDUCTOR AND COMMUNICATION DEVICE TOPPAN FORMS CO., LTD (JP) 2015-09-17 US claimed
US-20150008376-A1 Silver Ink Composition TOPPAN FORMS CO., LTD (JP) 2015-01-08 US claimed
EP-1905756-B1 SILVER BETA-KETOCARBOXYLATE DERIVATIVES FOR FORMING SILVER METAL UNIV OSAKA (JP) 2013-02-27 EP claimed
US-12119131-B2 Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part SENJU METAL INDUSTRY CO., LTD. (JP) 2024-10-15 US disclosed
US-20240045331-A1 PHOTOSENSITIVE RESIN COMPOSITION, BOARD WITH CONDUCTIVE PATTERN, ANTENNA ELEMENT, PRODUCTION METHOD FOR IMAGE DISPLAY DEVICE, AND PRODUCTION METHOD FOR TOUCH PANEL TORAY INDUSTRIES, INC. (JP) 2024-02-08 US disclosed
CN-116018655-B Photosensitive resin composition, substrate with conductive pattern, antenna element, method for manufacturing image display device, and method for manufacturing touch panel 东丽株式会社 2024-02-02 CN disclosed
CN-116018655-A Photosensitive resin composition, substrate with conductive pattern, antenna element, method for manufacturing image display device, and method for manufacturing touch panel 东丽株式会社 2023-04-25 CN disclosed
CN-112301346-B Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part 千住金属工业株式会社 2023-02-28 CN disclosed
US-11217359-B2 Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part SENJU METAL INDUSTRY CO., LTD. (JP) 2022-01-04 US disclosed
US-20210366627-A1 METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART SENJU METAL INDUSTRY CO., LTD. (JP) 2021-11-25 US disclosed
US-20180153034-A1 WIRING BOARD TOPPAN FORMS CO., LTD. (JP) 2018-05-31 US disclosed
US-20160330835-A1 WIRING BOARD TOPPAN FORMS CO., LTD. (JP) 2016-11-10 US disclosed
US-20160286653-A1 LAMINATE AND CIRCUIT BOARD TOPPAN EDGE INC. (JP) 2016-09-29 US disclosed
US-9371465-B2 Silver ink composition TOPPAN FORMS CO., LTD. (JP) 2016-06-21 US disclosed
US-20160155969-A1 Transistor THE UNIVERSITY OF TOKYO (JP) 2016-06-02 US disclosed
US-20150259557-A1 SILVER INK COMPOSITION, CONDUCTOR AND COMMUNICATION DEVICE TOPPAN FORMS CO., LTD (JP) 2015-09-17 US disclosed
US-20150008376-A1 Silver Ink Composition TOPPAN FORMS CO., LTD (JP) 2015-01-08 US disclosed
EP-1905756-B1 SILVER BETA-KETOCARBOXYLATE DERIVATIVES FOR FORMING SILVER METAL UNIV OSAKA (JP) 2013-02-27 EP disclosed