Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30248741 | 1.00 | ALDH1A1 (0.35) | ALDH1A1TSHRTDP1CA2 | |
| SCHEMBL5065183 | 0.81 | ALDH1A1 (0.43) | ALDH1A1TSHRTDP1CA2 | |
| SCHEMBL31695400 | 0.80 | ALDH1A1 (0.50) | ALDH1A1TSHRTDP1CA2 | |
| SCHEMBL59268 | 0.80 | ALDH1A1 (0.50) | ALDH1A1TSHRTDP1CA2 | |
| Water SCHEMBL104768 | 0.78 | ALDH1A1 (0.48) | ALDH1A1TSHRTDP1CA2 | |
| Iodide SCHEMBL6927732 | 0.78 | ALDH1A1 (0.48) | ALDH1A1TSHRTDP1CA2 | |
| Water SCHEMBL29908361 | 0.78 | ALDH1A1 (0.48) | ALDH1A1TSHRTDP1CA2 | |
| SCHEMBL29627980 | 0.77 | ALDH1A1 (0.34) | ALDH1A1TSHRTDP1CA2 | |
| SCHEMBL533855 | 0.77 | ALDH1A1 (0.34) | ALDH1A1TSHRTDP1CA2 | |
| SCHEMBL5412875 | 0.73 | NR1I2 (0.35) | ALDH1A1TSHRTDP1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8268540-B2 | Method of manufacturing light receiving device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2012-09-18 | — | — | US | disclosed |
| US-7915467-B2 | layer contains a cyclic olefin resin having an epoxy group and a photoacid generator; low stress properties and adhesion; prevent breakage of the semiconductor wafer in a process for grinding the backside to make them thinner | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-03-29 | — | — | US | disclosed |
| US-7808083-B2 | Semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2010-10-05 | — | — | US | disclosed |
| US-20100193122-A1 | PROCESS FOR MANUFACTURING ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-08-05 | — | — | US | disclosed |
| US-7768089-B2 | Semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2010-08-03 | — | — | US | disclosed |
| US-20100120937-A1 | SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-05-13 | — | — | US | disclosed |
| EP-2161744-A1 | ELECTRONIC DEVICE MANUFACTURING METHOD | Sumitomo Bakelite Co., Ltd. (JP) | 2010-03-10 | — | — | EP | disclosed |
| US-20090226848-A1 | Method of manufacturing light receiving device | SUMITOMO BAKELITE CO., LTD. (JP) | 2009-09-10 | — | — | US | disclosed |
| EP-2026385-A1 | METHOD FOR MANUFACTURING LIGHT RECEIVING APPARATUS | Sumitomo Bakelite Company, Ltd. (JP) | 2009-02-18 | — | — | EP | disclosed |
| US-20090008682-A1 | Light-Receiving Device | SUMITOMO BAKELITE CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |
| US-20080277805-A1 | Semiconductor Device | SUMITOMO BAKELITE CO., LTD. (JP) | 2008-11-13 | — | — | US | disclosed |
| US-20080090176-A1 | Semiconductor Wafer And Semiconductor Device | SUMITOMO BAKELITE CO., LTD. (JP) | 2008-04-17 | — | — | US | disclosed |
| EP-1804291-A1 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-07-04 | — | — | EP | disclosed |
| EP-1801872-A1 | SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-06-27 | — | — | EP | disclosed |
| US-20060228562-A1 | Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2006-10-12 | — | — | US | disclosed |