SCHEMBL14940241

SCHEMBL14940241

Nc1ccc(NS(=O)(=O)c2ccccc2N)cc1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KEAP1 Q14145 1/20 0.62
KMT2A Q03164 4/20 0.58
PTPN2 P17706 1/20 0.52
PTPN1 P18031 1/20 0.52
PTPN5 P54829 1/20 0.52
CA9 Q16790 4/20 0.51
CA1 P00915 3/20 0.51
CA2 P00918 3/20 0.51
HTT P42858 1/20 0.51
MEN1 O00255 3/20 0.50
ALDH1A1 P00352 1/20 0.50
CYP1A2 P05177 1/20 0.50
CYP3A4 P08684 1/20 0.50
MAPT P10636 1/20 0.50
CYP2C19 P33261 1/20 0.50
GAA P10253 1/20 0.50
CA12 O43570 1/20 0.48
CYP2C9 P11712 1/20 0.48
CA4 P22748 1/20 0.48
CA6 P23280 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2964279 0.89 KMT2A (0.56) KEAP1KMT2APTPN2PTPN1PTPN5
SCHEMBL7444314 0.86 CA1 (0.51) KEAP1KMT2APTPN2PTPN1PTPN5
SCHEMBL27176635 0.86 PKM (0.54) KEAP1KMT2APTPN2PTPN1PTPN5
SCHEMBL641594 0.86 CES1 (0.55) KEAP1KMT2APTPN2PTPN1PTPN5
SCHEMBL29118847 0.82 ALDH1A1 (0.65) KEAP1KMT2APTPN2PTPN1PTPN5
SCHEMBL30737530 0.82 POLB (0.60) KEAP1KMT2APTPN2PTPN1PTPN5
SCHEMBL3653048 0.82 KEAP1 (0.59) KEAP1KMT2APTPN2PTPN1PTPN5
SCHEMBL29118833 0.82 PGR (0.65) KEAP1KMT2APTPN2PTPN1PTPN5
SCHEMBL4067674 0.82 PGR (0.56) KMT2ACA1CA2HTTMEN1
SCHEMBL27176660 0.82 ALDH1A1 (0.53) KEAP1KMT2APTPN2PTPN1PTPN5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2776488-A1 HARDENERS FOR EPOXY RESIN COATINGS Sika Technology AG (CH) 2014-09-17 EP disclosed
EP-2776486-A1 HARDENERS FOR EPOXY RESINS, WHICH COMPRISE PYRIDINYL GROUPS Sika Technology AG (CH) 2014-09-17 EP disclosed
WO-2013068506-A1 HARDENERS FOR EPOXY RESINS, WHICH COMPRISE PYRIDINYL GROUPS SIKA TECHNOLOGY AG (CH) 2013-05-16 WO disclosed
WO-2013068501-A1 HARDENERS FOR EPOXY RESIN COATINGS SIKA TECHNOLOGY AG (CH) 2013-05-16 WO disclosed