SCHEMBL15024852

SCHEMBL15024852

OC(COCCN1CCOCC1)CC(F)(F)C(F)(F)CCC(F)(F)CC(F)(F)C(F)(F)CC(F)(F)F

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
USP2 O75604 1/20 0.31
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15025396 0.92 USP2 (0.31) USP2TSHR
SCHEMBL15025103 0.92 USP2 (0.36) USP2TSHR
SCHEMBL15025360 0.86 USP2 (0.35) USP2TSHR
SCHEMBL15025119 0.83 KDM4E (0.33)
SCHEMBL4806264 0.80 USP2 (0.36) USP2TSHR
SCHEMBL15025255 0.75 KDM4E (0.34)
SCHEMBL15024861 0.73 KDM4E (0.37)
SCHEMBL15025359 0.73 TSHR (0.31) TSHR
SCHEMBL15025040 0.73 ALDH1A1 (0.40)
SCHEMBL15025387 0.72 USP2 (0.46) USP2TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9158191-B2 Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-10-13 US disclosed
US-20130149493-A1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-06-13 US disclosed