SCHEMBL15064728

SCHEMBL15064728

O=C([O-])OC(=O)[O-].O=C([O-])OC(=O)[O-].[Ca+2].[Mg+2]

nearest known ligand 0.35

Known targets — ChEMBL curated mechanism

GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHMGCRMMP1MMP13MMP7MMP8PTGS1PTGS2ileSpolrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.33
CA4 P22748 1/20 0.33
FAHD1 Q6P587 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5776356 0.96
SCHEMBL1706124 0.96
Water SCHEMBL28754926 0.92
SCHEMBL9578850 0.92
SCHEMBL1461998 0.92 CA1 (0.33) CA1CA4FAHD1
SCHEMBL6294539 0.87 CA4 (0.36) CA1CA4FAHD1
SCHEMBL6541926 0.87 CA4 (0.36) CA1CA4FAHD1
SCHEMBL4359131 0.87 CA4 (0.36) CA1CA4FAHD1
SCHEMBL10459297 0.87
SCHEMBL526233 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3796342-B1 A POWER TRANSFORMER ASSEMBLY AND A THERMAL CONDUCTIVE COMPOUND FOR SEALING A POWER TRANSFORMER ASSEMBLY PREMO SA (ES) 2023-11-01 EP disclosed
US-20220340801-A1 A THERMAL CONDUCTIVE COMPOUND FOR SEALING A POWER TRANSFORMER ASSEMBLY AND A POWER TRANSFORMER ASSEMBLY PREMO, S.L. (ES) 2022-10-27 US disclosed
WO-2021052703-A9 A THERMAL CONDUCTIVE COMPOUND FOR SEALING A POWER TRANSFORMER ASSEMBLY AND A POWER TRANSFORMER ASSEMBLY PREMO, SA (ES) 2021-11-11 WO disclosed
US-9074108-B2 Potting compound suitable for potting an electronic component SIEMENS AKTIENGESELLSCHAFT (DE) 2015-07-07 US disclosed
US-20130169277-A1 POTTING COMPOUND SUITABLE FOR POTTING AN ELECTRONIC COMPONENT, IN PARTICULAR A LARGE-VOLUME COIL SUCH AS A GRADIENT COIL SIEMENS HEALTHCARE GMBH (DE) 2013-07-04 US disclosed