SCHEMBL15262

SCHEMBL15262

CCc1cc(Cc2cc(CC)c(N)c(CC)c2Cl)c(Cl)c(CC)c1N

nearest known ligand 0.38

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.38
POLB P06746 1/20 0.38
DHFR P00374 1/20 0.33
ALDH1A1 P00352 3/20 0.33
MAPT P10636 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.31
NOS3 P29474 1/20 0.31
NOS1 P29475 1/20 0.31
NOS2 P35228 1/20 0.31
TAAR1 Q96RJ0 1/20 0.30
CYP1A2 P05177 1/20 0.30
ALOX15 P16050 1/20 0.30
CASP7 P55210 1/20 0.30
HIF1A Q16665 1/20 0.30
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL3684772 0.98 HTT (0.37) HTTPOLBDHFRALDH1A1MAPT
SCHEMBL9361265 0.94 HTT (0.35) HTTPOLBDHFRALDH1A1MAPT
SCHEMBL166928 0.93 POLB (0.34) HTTPOLBDHFRTAAR1
SCHEMBL9361400 0.93 POLB (0.34) HTTPOLBDHFRALDH1A1
SCHEMBL166178 0.91 DHFR (0.42) HTTPOLBDHFR
SCHEMBL30854914 0.90 HTT (0.37) HTTPOLBALDH1A1MAPTSMN1; SMN2
SCHEMBL9365179 0.86 POLB (0.33) HTTPOLB
SCHEMBL9361610 0.85 HTT (0.39) HTTPOLBALDH1A1MAPTNOS3
SCHEMBL9362431 0.83 ALDH1A1 (0.36) HTTPOLBDHFRALDH1A1SMN1; SMN2
SCHEMBL117142 0.82 HTT (0.46) HTTPOLBDHFRALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 5552 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4098400-B1 POLISHING PAD AND METHOD FOR PREPARING A SEMICONDUCTOR DEVICE USING THE SAME ENPULSE CO LTD (KR) 2026-04-22 EP claimed
US-20260091462-A1 PAD FOR CHEMICAL MECHANICAL POLISHING DUPONT ELECTRONIC MAT HOLDING INC (US) 2026-04-02 US claimed
US-12570029-B2 Method for manufacturing polishing pad window, and polishing pad window manufactured thereby KPX Chemical Co., Ltd (KR) 2026-03-10 US claimed
US-12544958-B2 Method of making low specific gravity polishing pads ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2026-02-10 US claimed
US-12528152-B2 CMP pad having ultra expanded polymer microspheres ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2026-01-20 US claimed
US-12515295-B2 Polishing pad and method for preparing a semiconductor device using the same ENPULSE CO., LTD. (KR) 2026-01-06 US claimed
US-12503546-B2 Curable polyurethane prepolymer composition URETHANE SYSTEMS USA LLC (US) 2025-12-23 US claimed
EP-4296297-B1 EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES (JP) 2025-11-05 EP claimed
EP-4251672-B1 POLYMERIC MANNICH BASE, PREPARATION METHODS AND USE AS AN EPOXY RESIN CURATIVE JONES PAUL (GB) 2025-09-24 EP claimed
US-20250270363-A1 POLYURETHANE RESIN, ELASTIC MOLDED ARTICLE, AND METHOD FOR PRODUCING POLYURETHANE RESIN MITSUI CHEMICALS, INC. (JP) 2025-08-28 US claimed
US-5312651-A Using varnish from /1/ brominated 3-functional epoxy resin consisting of bisphenol A epoxy resin, specified triglycidyl ether, tetrabromobisphenol A, /2/ dicyandiamide and chloro diaminodiphenylmethane curing agent, /3/ an imidazole catalyst MATSUSHITA ELECTRIC WORKS, LTD. (JP) 1994-05-17 US claimed
US-5286874-A Process for the production of bismaleinimide derivatives LONZA LTD. (CH) 1994-02-15 US claimed
EP-0579989-A1 Polyurethaneurea elastomer IHARA CHEMICAL INDUSTRY Co., Ltd. (JP) 1994-01-26 EP claimed
EP-0544266-A1 Process for the preparation of bismaleimides LONZA AG (CH) 1993-06-02 EP claimed
US-5206338-A Molding materials; nontoxic; films; foams; fillers; lamination for aerospace and electrical products CIBA-GEIGY CORPORATION (US) 1993-04-27 US claimed
EP-0334771-B1 POLYMERS HAVING IMIDE GROUPS DERIVED FROM STERICALLY HINDERED DIAMINES, AND PROCESS FOR PREPARATION THEREOF CIBA-GEIGY AG (CH) 1992-11-11 EP claimed
US-5039775-A Process for producing polyurea resin IHARA CHEMICAL INDUSTRY CO., LTD. (JP) 1991-08-13 US claimed
US-5026815-A Chlorinated 4,4**1-methylenebisanilines LONZA LTD. (CH) 1991-06-25 US claimed
US-4973649-A BISMALEIMIDE, HINDERED AMINE, VINYL OR ALLYL SUBSTITUTED HETEROCYCLE, ACRYLIC ESTER RHONE-POULENC CHIMIE (FR) 1990-11-27 US claimed
US-4950792-A CHAIN LENGTHENING, CROSSLINKING AGENT FOR POLYURETHANES LONZA LTD. (CH) 1990-08-21 US claimed