SCHEMBL15301033

SCHEMBL15301033

CC(C)c1ccc(C2=NN(c3ccccc3)C(c3ccc(C(C)C)cc3)C2)cc1

nearest known ligand 0.62

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ EGFR P00533 8/20 0.62
▸ ERBB2 P04626 7/20 0.62
▸ ERBB3 P21860 2/20 0.62
▸ KDR P35968 2/20 0.62
▸ PTK2 Q05397 2/20 0.62
▸ MEN1 O00255 5/20 0.61
▸ KMT2A Q03164 5/20 0.61
▸ HSP90AA1 P07900 1/20 0.61
▸ GAA P10253 1/20 0.61
▸ ATM Q13315 4/20 0.58
▸ PRKCZ Q05513 3/20 0.57
▸ KDM4E B2RXH2 1/20 0.57
▸ ALDH1A1 P00352 1/20 0.57
▸ LMNA P02545 1/20 0.57
▸ MAPT P10636 1/20 0.57
▸ NR3C2 P08235 1/20 0.57
▸ RAB9A P51151 1/20 0.55
▸ L3MBTL1 Q9Y468 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15300830 0.97 EGFR (0.65) EGFRERBB2ERBB3KDRPTK2
SCHEMBL15301281 0.97 MEN1 (0.60) EGFRERBB2ERBB3KDRPTK2
SCHEMBL15301362 0.94 MEN1 (0.60) EGFRERBB2ERBB3KDRPTK2
SCHEMBL15301173 0.94 PRKCZ (0.64) EGFRERBB2ERBB3KDRPTK2
SCHEMBL23052047 0.94 EGFR (0.69) EGFRERBB2ERBB3KDRPTK2
SCHEMBL23052315 0.94 EGFR (0.69) EGFRERBB2ERBB3KDRPTK2
SCHEMBL18040117 0.93 PRKCZ (0.62) EGFRERBB2ERBB3KDRPTK2
SCHEMBL15301210 0.92 MEN1 (0.64) EGFRERBB2ERBB3KDRPTK2
SCHEMBL2689592 0.92 EGFR (0.54) EGFRERBB2ERBB3KDRPTK2
SCHEMBL15377485 0.92 EGFR (0.73) EGFRERBB2ERBB3KDRPTK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118355324-A Photosensitive resin composition, photosensitive element, method for producing cured product pattern, and method for producing circuit board 株式会社力森诺科 2024-07-16 — — CN disclosed
CN-118043365-A Polymer, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern 株式会社力森诺科 2024-05-14 — — CN disclosed
CN-111492309-B Photosensitive resin laminate 旭化成株式会社 2023-12-12 — — CN disclosed
CN-117083568-A Photosensitive element and method for manufacturing photosensitive element 株式会社力森诺科 2023-11-17 — — CN disclosed
CN-109690404-B Photosensitive resin composition and photosensitive resin laminate 旭化成株式会社 2023-04-04 — — CN disclosed
CN-110095937-B Photosensitive resin laminate and method for producing resist pattern 旭化成株式会社 2023-02-28 — — CN disclosed
US-9439291-B2 Photosensitive element, method for forming resist pattern, and method for producing printed circuit board HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-09-06 — — US disclosed
US-20130266900-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-10-10 — — US disclosed
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