Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 7/20 | 0.60 |
| ▸ | KMT2A | Q03164 | 7/20 | 0.60 |
| ▸ | ATM | Q13315 | 4/20 | 0.60 |
| ▸ | EGFR | P00533 | 7/20 | 0.58 |
| ▸ | ERBB2 | P04626 | 7/20 | 0.58 |
| ▸ | ERBB3 | P21860 | 2/20 | 0.58 |
| ▸ | KDR | P35968 | 2/20 | 0.58 |
| ▸ | PTK2 | Q05397 | 2/20 | 0.58 |
| ▸ | GAA | P10253 | 3/20 | 0.57 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.57 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.56 |
| ▸ | MAOA | P21397 | 1/20 | 0.56 |
| ▸ | MAOB | P27338 | 1/20 | 0.56 |
| ▸ | CA1 | P00915 | 3/20 | 0.55 |
| ▸ | CA2 | P00918 | 3/20 | 0.55 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.55 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.54 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.54 |
| ▸ | GLA | P06280 | 2/20 | 0.54 |
| ▸ | HTT | P42858 | 1/20 | 0.54 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15301033 | 0.97 | EGFR (0.62) | MEN1KMT2AATMEGFRERBB2 | |
| SCHEMBL15301362 | 0.97 | MEN1 (0.60) | MEN1KMT2AATMEGFRERBB2 | |
| SCHEMBL15300830 | 0.94 | EGFR (0.65) | MEN1KMT2AATMEGFRERBB2 | |
| SCHEMBL15301210 | 0.94 | MEN1 (0.64) | MEN1KMT2AATMEGFRERBB2 | |
| SCHEMBL15301173 | 0.92 | PRKCZ (0.64) | MEN1KMT2AATMEGFRERBB2 | |
| SCHEMBL23052047 | 0.91 | EGFR (0.69) | MEN1KMT2AATMEGFRERBB2 | |
| SCHEMBL23052315 | 0.91 | EGFR (0.69) | MEN1KMT2AATMEGFRERBB2 | |
| SCHEMBL18040117 | 0.90 | PRKCZ (0.62) | MEN1KMT2AEGFRERBB2ERBB3 | |
| SCHEMBL15377485 | 0.89 | EGFR (0.73) | MEN1KMT2AATMEGFRERBB2 | |
| SCHEMBL2689592 | 0.89 | EGFR (0.54) | MEN1KMT2AATMEGFRERBB2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100065-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2026-05-15 | — | — | WO | disclosed |
| US-20240059803-A1 | PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-02-22 | — | — | US | disclosed |
| CN-111527450-B | Photosensitive resin laminate and method for producing same | 旭化成株式会社 | 2023-08-08 | — | — | CN | disclosed |
| WO-2022186389-A1 | PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME | 旭化成株式会社 | 2022-09-09 | — | — | WO | disclosed |
| CN-108375874-B | Photosensitive resin composition, photosensitive resin laminate, substrate having resist pattern formed thereon, and method for producing circuit board | 旭化成株式会社 | 2021-10-22 | — | — | CN | disclosed |
| CN-111527450-A | Photosensitive resin laminate and method for producing same | 旭化成株式会社 | 2020-08-11 | — | — | CN | disclosed |
| CN-104781730-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 日立化成株式会社 | 2020-03-06 | — | — | CN | disclosed |
| CN-108375874-A | The manufacturing method of photosensitive polymer combination, photoresist laminated body, the substrate for being formed with corrosion-resisting pattern and circuit board | 旭化成株式会社 | 2018-08-07 | — | — | CN | disclosed |
| CN-107422606-A | The manufacture method of photosensitive element, the forming method of corrosion-resisting pattern and printed wiring board | 日立化成株式会社 | 2017-12-01 | — | — | CN | disclosed |
| CN-107367903-A | The manufacture method of photosensitive element, the forming method of corrosion-resisting pattern and printed wiring board | 日立化成株式会社 | 2017-11-21 | — | — | CN | disclosed |
| US-9439291-B2 | Photosensitive element, method for forming resist pattern, and method for producing printed circuit board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-09-06 | — | — | US | disclosed |
| US-20150293443-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-10-15 | — | — | US | disclosed |
| CN-104781730-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | HITACHI CHEMICAL CO LTD | 2015-07-15 | — | — | CN | disclosed |
| US-20130298398-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-11-14 | — | — | US | disclosed |
| US-20130266900-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-10-10 | — | — | US | disclosed |
| CN-103339568-A | Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for manufacturing printed wiring board | HITACHI CHEMICAL CO LTD | 2013-10-02 | — | — | CN | disclosed |
| CN-103261966-A | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | HITACHI CHEMICAL CO LTD | 2013-08-21 | — | — | CN | disclosed |
| CN-103221887-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | HITACHI CHEMICAL CO LTD | 2013-07-24 | — | — | CN | disclosed |
| CN-103091985-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL CO LTD | 2013-05-08 | — | — | CN | disclosed |
| CN-103076717-A | Photosensitive resin composition, photosensitive component, forming method of corrosion-resistant pattern and manufacturing method of printed wiring board | HITACHI CHEMICAL CO LTD | 2013-05-01 | — | — | CN | disclosed |