SCHEMBL18040117

SCHEMBL18040117

CC(C)c1ccc(C2=NN(c3ccc(C(C)C)cc3)C(c3ccc(C(C)C)cc3)C2)cc1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ PRKCZ Q05513 4/20 0.62
▸ LMNA P02545 2/20 0.55
▸ PKM P14618 1/20 0.55
▸ MEN1 O00255 4/20 0.54
▸ KMT2A Q03164 4/20 0.54
▸ KDM4E B2RXH2 1/20 0.54
▸ ALDH1A1 P00352 1/20 0.54
▸ MAPT P10636 1/20 0.54
▸ PTGS2 P35354 3/20 0.53
▸ EGFR P00533 5/20 0.52
▸ ERBB2 P04626 5/20 0.52
▸ ERBB3 P21860 2/20 0.52
▸ KDR P35968 2/20 0.52
▸ PTK2 Q05397 2/20 0.52
▸ HSP90AA1 P07900 1/20 0.51
▸ GAA P10253 1/20 0.51
▸ MAOB P27338 1/20 0.51
▸ L3MBTL1 Q9Y468 2/20 0.50
▸ CA12 O43570 1/20 0.50
▸ CA9 Q16790 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15301362 0.93 MEN1 (0.60) PRKCZLMNAMEN1KMT2AKDM4E
SCHEMBL15301173 0.93 PRKCZ (0.64) PRKCZLMNAMEN1KMT2AKDM4E
SCHEMBL15301033 0.93 EGFR (0.62) PRKCZLMNAMEN1KMT2AKDM4E
SCHEMBL29131693 0.91 MEN1 (0.69) LMNAMEN1KMT2AKDM4EALDH1A1
SCHEMBL29216367 0.91 PRKCZ (0.53) PRKCZLMNAPKMMEN1KMT2A
SCHEMBL29216369 0.91 PRKCZ (0.53) PRKCZLMNAPKMMEN1KMT2A
SCHEMBL15301210 0.90 MEN1 (0.64) PRKCZLMNAMEN1KMT2AKDM4E
SCHEMBL15300830 0.90 EGFR (0.65) PRKCZLMNAMEN1KMT2AKDM4E
SCHEMBL15301281 0.90 MEN1 (0.60) MEN1KMT2AKDM4EALDH1A1MAPT
SCHEMBL23052315 0.87 EGFR (0.69) PRKCZLMNAPKMMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025127002-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD 株式会社レゾナック 2025-06-19 — — WO disclosed
WO-2025126273-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD 株式会社レゾナック 2025-06-19 — — WO disclosed
WO-2025094282-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2025-05-08 — — WO disclosed
WO-2025074828-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD 株式会社レゾナック 2025-04-10 — — WO disclosed
CN-118043365-A Polymer, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern 株式会社力森诺科 2024-05-14 — — CN disclosed
CN-117083568-A Photosensitive element and method for manufacturing photosensitive element 株式会社力森诺科 2023-11-17 — — CN disclosed
US-9439291-B2 Photosensitive element, method for forming resist pattern, and method for producing printed circuit board HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-09-06 — — US disclosed
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