Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | TSHR | P16473 | 2/20 | 0.50 |
| ▸ | CA2 | P00918 | 2/20 | 0.46 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.40 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.40 |
| ▸ | KIF11 | P52732 | 1/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.33 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.33 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.33 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.33 |
| ▸ | GRIN2D | O15399 | 1/20 | 0.33 |
| ▸ | GRIN3B | O60391 | 1/20 | 0.33 |
| ▸ | GRIN1 | Q05586 | 1/20 | 0.33 |
| ▸ | GRIN2A | Q12879 | 1/20 | 0.33 |
| ▸ | GRIN2B | Q13224 | 1/20 | 0.33 |
| ▸ | GRIN2C | Q14957 | 1/20 | 0.33 |
| ▸ | GRIN3A | Q8TCU5 | 1/20 | 0.33 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2525283 | 0.80 | CA2 (0.46) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL27173776 | 0.76 | ALDH1A1 (0.44) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL9504489 | 0.76 | ALDH1A1 (0.44) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL2272712 | 0.76 | TDP1 (0.44) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL10607280 | 0.76 | GAA (0.39) | ALDH1A1TDP1TSHRCA2KIF11 | |
| SCHEMBL2522767 | 0.76 | CA2 (0.42) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL2273300 | 0.74 | ALDH1A1 (0.43) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL19921960 | 0.74 | ALDH1A1 (0.43) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| Methyl Alcohol SCHEMBL28457865 | 0.73 | ALDH1A1 (0.65) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL1576167 | 0.73 | ALDH1A1 (0.41) | ALDH1A1TDP1TSHRCA2GABRA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113168101-B | Photosensitive resin composition, method for producing pattern cured film, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2025-02-18 | — | — | CN | disclosed |
| CN-113168102-B | Photosensitive resin composition, method for producing pattern cured product, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-11-19 | — | — | CN | disclosed |
| CN-112334833-B | Negative photosensitive resin composition, polyimide using same, and method for producing cured relief pattern | 旭化成株式会社 | 2024-09-24 | — | — | CN | disclosed |
| CN-114502617-B | Polyimide precursor, photosensitive resin composition, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-05-03 | — | — | CN | disclosed |
| CN-117836927-A | Resin cured film, semiconductor device, and method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-04-05 | — | — | CN | disclosed |
| CN-117730398-A | Resin composition for dicing protective layer and method for processing semiconductor wafer | 株式会社力森诺科 | 2024-03-19 | — | — | CN | disclosed |
| CN-117280447-A | Photosensitive resin composition selection method, pattern cured film production method, cured film, semiconductor device, and semiconductor device production method | 株式会社力森诺科 | 2023-12-22 | — | — | CN | disclosed |
| CN-116774541-A | Toner comprising reactive charge control agent | 施乐公司 | 2023-09-19 | — | — | CN | disclosed |
| CN-116710498-A | Polyimide precursor resin composition and method for producing same | 旭化成株式会社 | 2023-09-05 | — | — | CN | disclosed |
| CN-116609998-A | Polyimide precursor, negative photosensitive resin composition, and method for producing cured relief pattern using same | 旭化成株式会社 | 2023-08-18 | — | — | CN | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| CN-116194840-A | Photosensitive resin composition, permanent resist, method for forming permanent resist, and method for inspecting cured film for permanent resist | 株式会社力森诺科 | 2023-05-30 | — | — | CN | disclosed |
| US-20210311390-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2021-10-07 | — | — | US | disclosed |
| US-9274422-B2 | Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2016-03-01 | — | — | US | disclosed |
| US-20140120462-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-05-01 | — | — | US | disclosed |