Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | SLC5A1 | P13866 | 1/20 | 0.31 |
| ▸ | SLC5A2 | P31639 | 1/20 | 0.31 |
| ▸ | HRH4 | Q9H3N8 | 4/20 | 0.30 |
| ▸ | HRH3 | Q9Y5N1 | 4/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6026327 | 0.83 | HPGD (0.38) | — | |
| SCHEMBL239227 | 0.81 | ALDH1A1 (0.46) | LMNASLC5A1SLC5A2 | |
| SCHEMBL14777169 | 0.78 | ALDH1A1 (0.38) | LMNA | |
| SCHEMBL6151122 | 0.78 | ALDH1A1 (0.38) | LMNA | |
| SCHEMBL1269546 | 0.74 | ALDH1A1 (0.42) | LMNA | |
| SCHEMBL16273365 | 0.74 | LMNA (0.42) | LMNAHRH4HRH3 | |
| SCHEMBL19441533 | 0.73 | LMNA (0.35) | LMNA | |
| SCHEMBL14777135 | 0.73 | GPR84 (0.36) | LMNAHRH3 | |
| SCHEMBL14777344 | 0.73 | GPR84 (0.36) | LMNAHRH3 | |
| SCHEMBL5066935 | 0.70 | ALDH1A1 (0.55) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9316907-B2 | Photosensitive resin composition and uses thereof | CHI MEI CORPORATION (TW) | 2016-04-19 | — | — | US | disclosed |
| US-9316907-B2 | Photosensitive resin composition and uses thereof | CHI MEI CORPORATION (TW) | 2016-04-19 | — | — | US | disclosed |
| US-20140255845-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF | CHI MEI CORPORATION (TW) | 2014-09-11 | — | — | US | disclosed |
| US-20140255845-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF | CHI MEI CORPORATION (TW) | 2014-09-11 | — | — | US | disclosed |