SCHEMBL16021071

SCHEMBL16021071

C=C(C)C(=O)NCC1COC(C)O1

nearest known ligand 0.44

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.44
CHRM2 P08172 2/20 0.40
CHRM5 P08912 2/20 0.40
CHRM1 P11229 2/20 0.40
TSHR P16473 1/20 0.40
MAPK1 P28482 1/20 0.40
KDM4E B2RXH2 1/20 0.39
CHRM4 P08173 1/20 0.39
CHRM3 P20309 1/20 0.39
HTT P42858 1/20 0.39
LMNA P02545 2/20 0.31
MTNR1A P48039 1/20 0.31
SMN1; SMN2 Q16637 2/20 0.30
NPSR1 Q6W5P4 1/20 0.30
NPC1 O15118 1/20 0.30
RAB9A P51151 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL183586 0.86 ALDH1A1 (0.47) ALDH1A1LMNAMTNR1ASMN1; SMN2NPSR1
SCHEMBL24898332 0.76 LMNA (0.47) ALDH1A1HTTLMNASMN1; SMN2NPSR1
SCHEMBL9923823 0.74 ALDH1A1 (0.75) ALDH1A1CHRM2CHRM5CHRM1TSHR
SCHEMBL14470794 0.74 ALDH1A1 (0.75) ALDH1A1CHRM2CHRM5CHRM1TSHR
SCHEMBL17343016 0.73 ALDH1A1 (0.44) ALDH1A1LMNAMTNR1ASMN1; SMN2RAB9A
SCHEMBL4256395 0.72 ALDH1A1 (0.53) ALDH1A1TSHRMAPK1SMN1; SMN2
SCHEMBL368273 0.72 LMNA (0.57) ALDH1A1HTTLMNASMN1; SMN2NPSR1
SCHEMBL17320280 0.72 CHRM2 (0.38) CHRM2CHRM5CHRM1TSHRMAPK1
SCHEMBL13789085 0.72 MTNR1A (0.38) ALDH1A1LMNAMTNR1ASMN1; SMN2NPSR1
SCHEMBL6825744 0.72 ALDH1A1 (0.35) ALDH1A1LMNASMN1; SMN2NPSR1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9316907-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2016-04-19 US disclosed
US-20140255845-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2014-09-11 US disclosed