4,4'-Methylenedianiline

4,4'-Methylenedianiline

SCHEMBL16040933

Cc1cccc(C)c1.N.N.Nc1ccc(Cc2ccc(N)cc2)cc1

nearest known ligand 0.61

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.61
CYP3A4 P08684 3/20 0.61
TSHR P16473 1/20 0.61
TDP1 Q9NUW8 1/20 0.61
ACHE P22303 2/20 0.52
TAAR1 Q96RJ0 2/20 0.50
LTA4H P09960 1/20 0.47
NPC1 O15118 2/20 0.46
RAB9A P51151 2/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
POLB P06746 2/20 0.46
LOXL2 Q9Y4K0 1/20 0.46
USP2 O75604 1/20 0.46
MAPK10 P53779 1/20 0.46
CYP1A2 P05177 1/20 0.46
CYP2D6 P10635 1/20 0.46
CYP2C9 P11712 1/20 0.46
CYP2C19 P33261 1/20 0.46
SAE1 Q9UBE0 1/20 0.46
UBA2 Q9UBT2 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20067936 0.92 TAAR1 (0.57) ALDH1A1CYP3A4TSHRTDP1ACHE
4,4'-Methylenedianiline SCHEMBL6567022 0.84 TSHR (0.64) ALDH1A1CYP3A4TSHRTDP1ACHE
4,4'-Methylenedianiline SCHEMBL16040935 0.84 ALDH1A1 (0.47) ALDH1A1CYP3A4TSHRTDP1ACHE
SCHEMBL26782341 0.82 CYP3A4 (0.67) ALDH1A1CYP3A4TSHRTDP1ACHE
SCHEMBL2923178 0.81 CYP3A4 (0.74) ALDH1A1CYP3A4TSHRTDP1ACHE
SCHEMBL8771469 0.81 CYP3A4 (0.74) ALDH1A1CYP3A4TSHRTDP1ACHE
4,4'-Methylenedianiline SCHEMBL4062058 0.81 CYP3A4 (0.93) ALDH1A1CYP3A4TSHRTDP1LOXL2
4,4'-Methylenedianiline SCHEMBL2529236 0.81 CYP3A4 (0.93) ALDH1A1CYP3A4TSHRTDP1LOXL2
SCHEMBL12602604 0.80 CYP3A4 (0.64) ALDH1A1CYP3A4TSHRTDP1ACHE
Diphenylmethane SCHEMBL3723822 0.79 ACHE (0.60) TSHRACHETAAR1LTA4HNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2787017-A2 Epoxy resin adducts and thermosets thereof Dow Global Technologies LLC (US) 2014-10-08 EP disclosed
US-20140275343-A1 EPOXY RESIN ADDUCTS AND THERMOSETS THEREOF DOW GLOBAL TECHNOLOGIES LLC (US) 2014-09-18 US disclosed