SCHEMBL1609563

SCHEMBL1609563

CCCCCO[Si](CCCC)(CCCC)OC

nearest known ligand 0.34

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.34
CA1 P00915 7/20 0.31
CA2 P00918 7/20 0.31
CA9 Q16790 7/20 0.31
THRB P10828 2/20 0.31
CA12 O43570 2/20 0.31
MEN1 O00255 1/20 0.31
HTT P42858 1/20 0.31
KMT2A Q03164 1/20 0.31
MAPT P10636 1/20 0.31
TSHR P16473 1/20 0.30
LPAR3 Q9UBY5 6/20 0.30
LPAR2 Q9HBW0 5/20 0.30
LPAR1 Q92633 2/20 0.30
NAAA Q02083 1/20 0.30
CA3 P07451 1/20 0.30
CA4 P22748 1/20 0.30
CA6 P23280 1/20 0.30
CA5A P35218 1/20 0.30
CA7 P43166 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5596025 0.92 DNM1 (0.39) LMNACA1CA2CA9MEN1
SCHEMBL1608616 0.88 LMNA (0.31) LMNA
SCHEMBL19809370 0.88 THRB (0.35) CA1CA2CA9THRBCA12
SCHEMBL5595926 0.86 DNM1 (0.43) LMNACA1CA2CA9CA12
SCHEMBL11349951 0.86 THRB (0.40) CA1CA2CA9THRBMEN1
SCHEMBL19809345 0.84
SCHEMBL28779819 0.84 ADRB2 (0.35) LMNATSHR
SCHEMBL19809194 0.84 CA1 (0.32) CA1CA2CA9THRBCA12
SCHEMBL19809168 0.84 NR5A1 (0.32) CA1CA2CA9THRBCA12
SCHEMBL17216628 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114437263-A Low-VOC low-odor polypropylene resin and preparation method and application thereof 中国石油化工股份有限公司 2022-05-06 CN claimed
CN-114716591-A Catalyst component for propylene polymerization, preparation method and application thereof 任丘市利和科技发展有限公司 2022-07-08 CN disclosed
CN-109111535-B Catalyst component for olefin polymerization and catalyst thereof 中国石油化工股份有限公司 2021-03-16 CN disclosed
CN-109111536-B Catalyst component for olefin polymerization and catalyst thereof 中国石油化工股份有限公司 2021-03-16 CN disclosed
CN-109111537-B Catalyst component for olefin polymerization and catalyst thereof 中国石油化工股份有限公司 2021-03-16 CN disclosed
CN-109111538-B Catalyst component for olefin polymerization and catalyst thereof 中国石油化工股份有限公司 2021-02-05 CN disclosed
CN-109111539-B Catalyst component for olefin polymerization and catalyst thereof 中国石油化工股份有限公司 2021-02-05 CN disclosed
CN-107075119-B Method for producing siloxane resin 株式会社钟化 2021-01-05 CN disclosed
US-9870924-B2 Diffusion agent composition, method of forming impurity diffusion layer, and solar cell TOKYO OHKA KOGYO CO., LTD. (JP) 2018-01-16 US disclosed
EP-2131423-B1 NEGATIVE ELECTRODE BASE MEMBER TOKYO OHKA KOGYO CO LTD (JP) 2017-11-15 EP disclosed
EP-2573800-A1 DIFFUSION AGENT COMPOSITION, METHOD OF FORMING AN IMPURITY DIFFUSION LAYER, AND SOLAR CELL Tokyo Ohka Kogyo Co., Ltd. (JP) 2013-03-27 EP disclosed
US-20130061922-A1 DIFFUSION AGENT COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR CELL TOKYO OHKA KOGYO CO., LTD. (JP) 2013-03-14 US disclosed
EP-2472655-A1 Negative electrode base member Tokyo Ohka Kogyo Co., Ltd. (JP) 2012-07-04 EP disclosed
US-20110079262-A1 DIFFUSING AGENT COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR BATTERY TOKYO OHKA KOGYO CO., LTD. (JP) 2011-04-07 US disclosed
US-20110017291-A1 DIFFUSING AGENT COMPOSITION FOR INK-JET, AND METHOD FOR PRODUCTION OF ELECTRODE OR SOLAR BATTERY USING THE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2011-01-27 US disclosed
CN-101010635-B Composition for forming antireflective film and wiring forming method using same TOKYO OHKA KOGYO CO LTD 2010-06-16 CN disclosed
US-20100119939-A1 NEGATIVE ELECTRODE BASE MEMBER TOKYO OHKA KOGYO CO., LTD. (JP) 2010-05-13 US disclosed
EP-2131423-A1 NEGATIVE ELECTRODE BASE MEMBER Tokyo Ohka Kogyo Co., Ltd. (JP) 2009-12-09 EP disclosed
US-20080318165-A1 Composition For Forming Antireflective Film And Wiring Forming Method Using Same TOKYO OHKA KOGYO CO., LTD. (JP) 2008-12-25 US disclosed
CN-101010635-A Composition for forming antireflective film and wiring forming method using same TOKYO OHKA KOGYO CO LTD (JP) 2007-08-01 CN disclosed