Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.47 |
| ▸ | NPC1 | O15118 | 1/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.47 |
| ▸ | MAPT | P10636 | 1/20 | 0.47 |
| ▸ | HPGD | P15428 | 1/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.47 |
| ▸ | RAB9A | P51151 | 1/20 | 0.47 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.47 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.47 |
| ▸ | PTPN11 | Q06124 | 5/20 | 0.46 |
| ▸ | S1PR3 | Q99500 | 1/20 | 0.46 |
| ▸ | PPARG | P37231 | 1/20 | 0.46 |
| ▸ | PPARA | Q07869 | 1/20 | 0.46 |
| ▸ | RARA | P10276 | 1/20 | 0.44 |
| ▸ | RARB | P10826 | 1/20 | 0.44 |
| ▸ | RXRA | P19793 | 1/20 | 0.44 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.44 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.44 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.43 |
| ▸ | PTPN6 | P29350 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7484904 | 0.88 | KDM4E (0.55) | KDM4EALDH1A1MAPTSMN1; SMN2PTPN11 | |
| SCHEMBL1830431 | 0.84 | RAB9A (0.47) | KDM4ENPC1ALDH1A1MAPTHPGD | |
| SCHEMBL4304889 | 0.81 | PPARG (0.55) | KDM4ESMN1; SMN2PTPN11S1PR3PPARG | |
| SCHEMBL1750042 | 0.81 | PTPN11 (0.57) | KDM4EALDH1A1MCL1PTPN11PPARG | |
| SCHEMBL13206046 | 0.80 | ACLY (0.48) | PTPN11RARARARBPTPN1TP53 | |
| SCHEMBL11776705 | 0.80 | TSHR (0.55) | KDM4EALDH1A1SMN1; SMN2PTPN11S1PR3 | |
| SCHEMBL8243911 | 0.80 | ESR1 (0.50) | NPC1ALDH1A1MAPTMAPK1RAB9A | |
| SCHEMBL10624476 | 0.80 | PTPN11 (0.63) | ALDH1A1HPGDPTPN11RARBTSHR | |
| SCHEMBL308244 | 0.79 | RARB (0.45) | KDM4ENPC1ALDH1A1MAPTHPGD | |
| SCHEMBL27908567 | 0.79 | LMNA (0.59) | KDM4ENPC1ALDH1A1MAPTHPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10192650-B2 | Photosensitive conductive paste, method of producing multilayer electronic component using the same, and multilayer electronic component | MURATA MANUFACTURING CO., LTD. (JP) | 2019-01-29 | — | — | US | claimed |
| US-20170236611-A1 | PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD OF PRODUCING MULTILAYER ELECTRONIC COMPONENT USING THE SAME, AND MULTILAYER ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. (JP) | 2017-08-17 | — | — | US | claimed |
| EP-2370525-B1 | A SOLVENTLESS ANTIMICROBIAL UV CURABLE COATING COMPOSITIONS | BECTON DICKINSON CO (US) | 2017-01-25 | — | — | EP | claimed |
| US-20250236719-A1 | RESIN COMPOSITION | MURATA MANUFACTURING CO., LTD. (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20240177911-A1 | PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. (JP) | 2024-05-30 | — | — | US | disclosed |
| CN-118073002-A | Photosensitive conductive paste, method for producing laminated electronic component, and laminated electronic component | 株式会社村田制作所 | 2024-05-24 | — | — | CN | disclosed |
| US-20240085787-A1 | PHOTOSENSITIVE PASTE, METHOD FOR FORMING WIRING PATTERN, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. (JP) | 2024-03-14 | — | — | US | disclosed |
| CN-117631452-A | Photosensitive paste, wiring pattern forming method, electronic component manufacturing method, and electronic component | 株式会社村田制作所 | 2024-03-01 | — | — | CN | disclosed |
| CN-109416508-B | Photosensitive conductive paste, method for producing laminated electronic component, and laminated electronic component | 株式会社村田制作所 | 2022-03-15 | — | — | CN | disclosed |
| CN-106940514-B | Photosensitive resin composition and photosensitive paste using same | 株式会社村田制作所 | 2021-10-08 | — | — | CN | disclosed |
| CN-109565941-B | Ceramic electronic component | 株式会社村田制作所 | 2021-07-20 | — | — | CN | disclosed |
| US-20030036020-A1 | Photosensitive conductive paste, method for forming conductive pattern using the same, and method for manufacturing ceramic multilayer element | MURATA MANUFACTURING CO., LTD. (JP) | 2003-02-20 | — | — | US | disclosed |
| US-20020106577-A1 | Photosensitive copper paste and method of forming copper pattern using the same | MURATA MANUFACTURING CO., LTD. | 2002-08-08 | — | — | US | disclosed |
| US-20020076657-A1 | Method for forming thick film pattern and photosensitive paste used therefor | MURATA MANUFACTURING CO., LTD. | 2002-06-20 | — | — | US | disclosed |
| US-6399282-B1 | Method for forming conductive pattern and producing ceramic multi-layer substrate | MURATA MANUFACTURING CO., LTD. (JP) | 2002-06-04 | — | — | US | disclosed |
| US-6346564-B1 | PASTE COMPRISING MIXTURE OF ORGANIC BINDER HAVING ACIDIC FUNCTIONAL GROUP, AT LEAST ONE POLYVALENT METAL OR POLYVALENT METALLIC COMPOUND, ANION-ADSORPTIVE SUBSTANCE WHICH ADSORBS ANION OF BINDER | MURATA MANUFACTURING CO., LTD. (JP) | 2002-02-12 | — | — | US | disclosed |
| US-6315927-B1 | USED FOR FORMING WIRING PATTERN OF A HIGH-FREQUENCY ELECTRONIC COMPONENT; STORAGE STABILITY | MURATA MANUFACTURING CO., LTD. (JP) | 2001-11-13 | — | — | US | disclosed |
| US-20010033219-A1 | Photosensitive thick film composition and electronic device using the same | MURATA MANUFACTURING CO., LTD. | 2001-10-25 | — | — | US | disclosed |
| US-6183669-B1 | Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate | MURATA MANUFACTURING CO., LTD. (JP) | 2001-02-06 | — | — | US | disclosed |
| US-6156237-A | Conductive paste and circuit substrate formed by use of the paste | MURATA MANUFACTURING CO., LTD. (JP) | 2000-12-05 | — | — | US | disclosed |