SCHEMBL16200770

SCHEMBL16200770

CCC(CC(CC(C)c1ccc(OC(C)OCCC2CCCCC2)cc1)c1ccc(OC(C)OCCC2CCCCC2)cc1)c1ccc(OC(C)OCCC2CCCCC2)cc1

nearest known ligand 0.35

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
NFE2L2 Q16236 1/20 0.35
KLK7 P49862 1/20 0.32
FFAR1 O14842 1/20 0.32
ALDH1A1 P00352 2/20 0.32
PPARG P37231 1/20 0.31
PPARD Q03181 1/20 0.31
PPARA Q07869 1/20 0.31
KMT2A Q03164 2/20 0.31
MEN1 O00255 1/20 0.31
MITF O75030 1/20 0.31
MAPT P10636 1/20 0.30
HTT P42858 1/20 0.30
SLC6A2 P23975 1/20 0.30
SLC6A4 P31645 1/20 0.30
SLC6A3 Q01959 1/20 0.30
KDM4E B2RXH2 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16865926 1.00 NFE2L2 (0.35) NFE2L2KLK7FFAR1ALDH1A1PPARG
SCHEMBL16865914 1.00 NFE2L2 (0.35) NFE2L2KLK7FFAR1ALDH1A1PPARG
SCHEMBL825478 0.93 ESR1 (0.33) NFE2L2KLK7FFAR1ALDH1A1PPARG
SCHEMBL13098465 0.93 ESR1 (0.33) NFE2L2KLK7FFAR1ALDH1A1PPARG
SCHEMBL13098486 0.90 GRIA4 (0.30) PPARGPPARDPPARA
SCHEMBL13098474 0.88 KDM4E (0.35) KLK7FFAR1PPARGPPARDPPARA
SCHEMBL14049134 0.87 ALDH1A1 (0.42) NFE2L2KLK7FFAR1ALDH1A1PPARG
SCHEMBL111625 0.87 ALDH1A1 (0.42) NFE2L2KLK7FFAR1ALDH1A1PPARG
SCHEMBL25504988 0.86 NFE2L2 (0.40) NFE2L2FFAR1ALDH1A1PPARGPPARD
SCHEMBL683300 0.86 ALDH1A1 (0.43) NFE2L2KLK7FFAR1ALDH1A1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140322914-A1 GAP EMBEDDING COMPOSITION, METHOD OF EMBEDDING GAP AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE BY USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2014-10-30 US disclosed