Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.47 |
| ▸ | SLC6A3 | Q01959 | 2/20 | 0.43 |
| ▸ | HPGD | P15428 | 1/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.42 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.42 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.41 |
| ▸ | FKBP1A | P62942 | 3/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10799911 | 0.81 | SLC6A3 (0.37) | SLC6A3HPGD | |
| SCHEMBL13311347 | 0.80 | CYP1A2 (0.44) | CYP1A2SLC6A3HPGDCYP3A4CYP2C9 | |
| SCHEMBL10807859 | 0.80 | SLC6A3 (0.36) | SLC6A3HPGD | |
| SCHEMBL10575720 | 0.80 | SLC6A3 (0.43) | SLC6A3HPGDALDH1A1 | |
| SCHEMBL1506741 | 0.79 | FKBP1A (0.42) | CYP1A2SLC6A3SIGMAR1FKBP1AALDH1A1 | |
| SCHEMBL10800895 | 0.79 | SLC6A3 (0.42) | SLC6A3HPGDALDH1A1 | |
| SCHEMBL26642990 | 0.78 | CYP1A2 (0.46) | CYP1A2HPGDFKBP1AALDH1A1 | |
| SCHEMBL13311344 | 0.77 | CYP1A2 (0.42) | CYP1A2SLC6A3CYP3A4CYP2C9CYP2C19 | |
| SCHEMBL15879424 | 0.77 | CYP1A2 (0.53) | CYP1A2CYP3A4 | |
| SCHEMBL939536 | 0.77 | ALDH1A1 (0.64) | SLC6A3HPGDALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2010026973-A1 | PHOTOSENSITIVE COMPOSITION, PATTERN-FORMING METHOD USING THE COMPOSITION AND RESIN USED IN THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2010-03-11 | — | — | WO | disclosed |