Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BACE1 | P56817 | 1/20 | 0.38 |
| ▸ | SCN10A | Q9Y5Y9 | 7/20 | 0.37 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | PDE10A | Q9Y233 | 1/20 | 0.36 |
| ▸ | PON1 | P27169 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | METAP2 | P50579 | 1/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.32 |
| ▸ | MCHR1 | Q99705 | 1/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.32 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10222604 | 0.84 | BACE1 (0.39) | BACE1SCN10AKCNH2KMT2AMEN1 | |
| SCHEMBL6754978 | 0.83 | BACE1 (0.57) | BACE1KCNH2PDE10AMETAP2MCHR1 | |
| SCHEMBL29485681 | 0.79 | MEN1 (0.38) | BACE1SCN10AKCNH2KMT2AMEN1 | |
| SCHEMBL16492037 | 0.79 | MEN1 (0.38) | BACE1SCN10AKCNH2KMT2AMEN1 | |
| SCHEMBL12025091 | 0.77 | BACE1 (0.44) | BACE1SCN10AKCNH2KMT2AMEN1 | |
| SCHEMBL1724199 | 0.77 | CYP1A2 (0.57) | BACE1KMT2AMEN1ALDH1A1HPGD | |
| SCHEMBL10182842 | 0.74 | CYP1A2 (0.59) | BACE1SCN10AKCNH2KMT2AMEN1 | |
| SCHEMBL2704185 | 0.74 | KCNH2 (0.42) | BACE1SCN10AKCNH2KMT2AMEN1 | |
| SCHEMBL2412433 | 0.74 | HDAC1 (0.47) | BACE1KMT2APDE10ANPSR1 | |
| SCHEMBL2921137 | 0.73 | PLAU (0.57) | BACE1KCNH2KMT2AMEN1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12559675-B2 | Resin composition and molded object | DIC CORPORATION (JP) | 2026-02-24 | — | — | US | disclosed |
| US-20250179256-A1 | MASTERBATCH, RESIN COMPOSITION INCLUDING SAME, AND METHOD FOR PRODUCING MOLDED OBJECT | DIC CORPORATION (JP) | 2025-06-05 | — | — | US | disclosed |
| US-20250051638-A1 | POWDERED FLUOROCHROME COMPOSITION, RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING POWDERED FLUOROCHROME COMPOSITION | DIC CORPORATION (JP) | 2025-02-13 | — | — | US | disclosed |
| EP-4497774-A1 | MASTERBATCH, RESIN COMPOSITION INCLUDING SAME, AND METHOD FOR PRODUCING MOLDED OBJECT | DIC Corporation (JP) | 2025-01-29 | — | — | EP | disclosed |
| CN-118871508-A | Masterbatch, resin composition using same, and method for producing molded article | DIC株式会社 | 2024-10-29 | — | — | CN | disclosed |
| CN-118434822-A | Powdery pigment composition, method for producing powdery pigment composition, resin composition, and molded article | DIC株式会社 | 2024-08-02 | — | — | CN | disclosed |
| US-20240034927-A1 | RESIN COMPOSITION AND MOLDED OBJECT | DIC CORPORATION (JP) | 2024-02-01 | — | — | US | disclosed |
| WO-2023182121-A1 | MASTERBATCH, RESIN COMPOSITION INCLUDING SAME, AND METHOD FOR PRODUCING MOLDED OBJECT | DIC株式会社 | 2023-09-28 | — | — | WO | disclosed |
| EP-4215574-A1 | RESIN COMPOSITION AND MOLDED OBJECT | DIC Corporation (JP) | 2023-07-26 | — | — | EP | disclosed |
| EP-4215574-A1 | RESIN COMPOSITION AND MOLDED OBJECT | DIC Corporation (JP) | 2023-07-26 | — | — | EP | disclosed |
| US-20160271273-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | DIC CORPORATION (JP) | 2016-09-22 | — | — | US | disclosed |
| US-20160271273-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | DIC CORPORATION (JP) | 2016-09-22 | — | — | US | disclosed |
| US-20160271273-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | DIC CORPORATION (JP) | 2016-09-22 | — | — | US | disclosed |
| WO-2016132597-A1 | RESIN COMPOSITION AND MOLDED BODY | DIC株式会社 | 2016-08-25 | — | — | WO | disclosed |
| EP-3059288-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | DIC Corporation (JP) | 2016-08-24 | — | — | EP | disclosed |
| US-20160200970-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | NATIONAL UNIVERSITY CORPORATION KOCHI UNIVERSITY (JP) | 2016-07-14 | — | — | US | disclosed |
| US-20160200970-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | NATIONAL UNIVERSITY CORPORATION KOCHI UNIVERSITY (JP) | 2016-07-14 | — | — | US | disclosed |
| US-20160200970-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | NATIONAL UNIVERSITY CORPORATION KOCHI UNIVERSITY (JP) | 2016-07-14 | — | — | US | disclosed |
| EP-3034580-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | DIC Corporation (JP) | 2016-06-22 | — | — | EP | disclosed |
| WO-2015022977-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | DIC株式会社 (JP) | 2015-02-19 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12559675-B2 | Resin composition and molded object | RER1, MAPRE1, MAPRE2 | BACE1 4054/4885SCN10A 4188/4885KCNH2 2657/4885 |
| US-20160271273-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | IK, CBR3, RER1 | BACE1 3851/4885SCN10A 3944/4885KCNH2 1655/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.