Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.46 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.38 |
| ▸ | PDE4A | P27815 | 1/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | SLC6A6 | P31641 | 1/20 | 0.38 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.38 |
| ▸ | BLM | P54132 | 1/20 | 0.38 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16500026 | 1.00 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL10484655 | 0.97 | APP (0.44) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL600058 | 0.97 | APP (0.44) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL518982 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL856905 | 0.95 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL220968 | 0.89 | APP (0.50) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL1646543 | 0.86 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL21808785 | 0.86 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL929912 | 0.86 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL10484571 | 0.86 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3178968-B1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH | DIPSOL CHEM (JP) | 2019-09-04 | — | — | EP | disclosed |
| EP-3208364-B1 | COPPER-NICKEL ALLOY ELECTROPLATING DEVICE | DIPSOL CHEM (JP) | 2019-08-07 | — | — | EP | disclosed |
| US-10316421-B2 | Copper-nickel alloy electroplating bath | DIPSOL CHEMICALS CO., LTD. (JP) | 2019-06-11 | — | — | US | disclosed |
| US-9828686-B2 | Copper-nickel alloy electroplating bath and plating method | DIPSOL CHEMICALS CO., LTD. (JP) | 2017-11-28 | — | — | US | disclosed |
| US-20170241040-A1 | COPPER-NICKEL ALLOY ELECTROPLATING DEVICE | DIPSOL CHEMICALS CO., LTD. (JP) | 2017-08-24 | — | — | US | disclosed |
| US-20170241031-A1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH | DIPSOL CHEMICALS CO., LTD. (JP) | 2017-08-24 | — | — | US | disclosed |
| EP-3208364-A1 | COPPER-NICKEL ALLOY ELECTROPLATING DEVICE | Dipsol Chemicals Co., Ltd. (JP) | 2017-08-23 | — | — | EP | disclosed |
| EP-3178968-A1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH | Dipsol Chemicals Co., Ltd. (JP) | 2017-06-14 | — | — | EP | disclosed |
| EP-2840169-B1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH AND PLATING METHOD | DIPSOL CHEM (JP) | 2017-03-01 | — | — | EP | disclosed |
| US-20150090600-A1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH AND PLATING METHOD | DIPSOL CHEMICALS CO., LTD. (JP) | 2015-04-02 | — | — | US | disclosed |
| EP-2840169-A1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH AND PLATING METHOD | Dipsol Chemicals Co., Ltd. (JP) | 2015-02-25 | — | — | EP | disclosed |