Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.48 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.39 |
| ▸ | PDE4A | P27815 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | SLC6A6 | P31641 | 1/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.39 |
| ▸ | BLM | P54132 | 1/20 | 0.39 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16499985 | 0.97 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL16500026 | 0.97 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL856905 | 0.97 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL600058 | 0.95 | APP (0.44) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL10484655 | 0.95 | APP (0.44) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL220968 | 0.92 | APP (0.50) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL1646543 | 0.89 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL10484571 | 0.89 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL1258894 | 0.89 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL21808785 | 0.89 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 227 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12281403-B2 | Method for electroplating nanograined copper | Umicore Suzhou semiconductor Materials co., Ltd. (CN) | 2025-04-22 | — | — | US | claimed |
| EP-4476387-A1 | METHOD FOR ELECTROPLATING NANOGRAINED COPPER | Umicore Suzhou semiconductor Materials co., Ltd. (CN) | 2024-12-18 | — | — | EP | claimed |
| CN-116897223-A | Method for electroplating nano copper crystal grain | 苏州昕皓新材料科技有限公司 | 2023-10-17 | — | — | CN | claimed |
| US-11746433-B2 | Single step electrolytic method of filling through holes in printed circuit boards and other substrates | MACDERMID ENTHONE INC. (US) | 2023-09-05 | — | — | US | claimed |
| WO-2023151029-A1 | METHOD FOR ELECTROPLATING NANOGRAINED COPPER | SUZHOU SHINHAO MATERIALS LLC (CN) | 2023-08-17 | — | — | WO | claimed |
| US-20230257896-A1 | METHOD FOR ELECTROPLATING NANOGRAINED COPPER | Umicore Suzhou semiconductor Materials co., Ltd. (CN) | 2023-08-17 | — | — | US | claimed |
| CN-112899736-A | PCB high-longitudinal-transverse-through-hole electro-coppering additive and preparation method thereof | 深圳中科利尔科技有限公司 | 2021-06-04 | — | — | CN | claimed |
| US-10982343-B2 | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-04-20 | — | — | US | claimed |
| US-20200347504-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-11-05 | — | — | US | claimed |
| EP-3483307-B1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-04-01 | — | — | EP | claimed |
| US-20050087447-A1 | Addition of cyanine dye allows copper plating from trenches and vias having high aspect ratio which have been formed on surfaces of substrate; electromigration | HABA TOSHIO (JP) | 2005-04-28 | — | — | US | claimed |
| EP-0785297-B1 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH DEUTSCHLAND GMBH (DE) | 2000-01-05 | — | — | EP | claimed |
| EP-0785297-A2 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH Deutschland GmbH (DE) | 1997-07-23 | — | — | EP | claimed |
| EP-0598763-B1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1995-12-13 | — | — | EP | claimed |
| EP-0554275-B1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE | ATOTECH DEUTSCHLAND GMBH (DE) | 1994-12-14 | — | — | EP | claimed |
| EP-0554275-A1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE. | SCHERING AG (DE) | 1993-08-11 | — | — | EP | claimed |
| EP-0297306-B1 | AQUEOUS ACID BATH FOR THE GALVANIC DEPOSITION OF BRIGHTENING AND LEVELING COPPER COATINGS | SCHERING AKTIENGESELLSCHAFT (DE) | 1993-01-20 | — | — | EP | claimed |
| WO-1992007116-A1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE | SCHERING AKTIENGESELLSCHAFT (DE) | 1992-04-30 | — | — | WO | claimed |
| US-4975159-A | Copper salt, inorganic acid and alkoxylated lactam; reinforcing electroconductivity of printed circuit | SCHERING AKTIENGESELLSCHAFT (DE) | 1990-12-04 | — | — | US | claimed |
| EP-0297306-A1 | Aqueous acid bath for the galvanic deposition of brightening and leveling copper coatings | SCHERING AKTIENGESELLSCHAFT (DE) | 1989-01-04 | — | — | EP | claimed |