SCHEMBL16591102

SCHEMBL16591102

CCC(C)(C)C(=O)OCOCc1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
RIPK1 Q13546 3/20 0.46
ALDH1A1 P00352 6/20 0.46
TSHR P16473 2/20 0.42
SMN1; SMN2 Q16637 3/20 0.41
MMP8 P22894 1/20 0.41
KMT2A Q03164 4/20 0.41
MAPK1 P28482 2/20 0.41
L3MBTL1 Q9Y468 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
SLC6A2 P23975 1/20 0.41
SLC6A3 Q01959 1/20 0.41
MEN1 O00255 3/20 0.41
KDM4E B2RXH2 1/20 0.41
MAPT P10636 1/20 0.41
CYP3A4 P08684 1/20 0.39
LMNA P02545 1/20 0.39
GAA P10253 1/20 0.39
RECQL P46063 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7345882 0.89 ALDH1A1 (0.47) ALDH1A1TSHRSMN1; SMN2MMP8KMT2A
SCHEMBL116845 0.87 ALDH1A1 (0.56) RIPK1ALDH1A1TSHRSMN1; SMN2MMP8
SCHEMBL14434080 0.86 KMT2A (0.46) RIPK1ALDH1A1TSHRSMN1; SMN2MMP8
SCHEMBL24250989 0.85 ALDH1A1 (0.50) ALDH1A1TSHRSMN1; SMN2MMP8KMT2A
SCHEMBL18961213 0.83 ALOX5 (0.44)
SCHEMBL27652957 0.79 ALDH1A1 (0.47) RIPK1ALDH1A1TSHRSMN1; SMN2KMT2A
SCHEMBL27338787 0.78 ALDH1A1 (0.53) ALDH1A1TSHRSMN1; SMN2KMT2AMAPK1
SCHEMBL12733152 0.78 RAB9A (0.48) ALDH1A1SMN1; SMN2KMT2AMEN1MAPT
SCHEMBL19728227 0.78 ALDH1A1 (0.50) RIPK1ALDH1A1TSHRSMN1; SMN2KMT2A
SCHEMBL17848824 0.78 ALDH1A1 (0.49) RIPK1ALDH1A1TSHRSMN1; SMN2KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230229078-A1 CHEMICAL LIQUID SUPPLY METHOD AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2023-07-20 US disclosed
US-11693321-B2 Treatment liquid for manufacturing semiconductor, storage container storing treatment liquid for manufacturing semiconductor, pattern forming method, and method of manufacturing electronic device FUJIFILM CORPORATION (JP) 2023-07-04 US disclosed
US-20230135117-A1 SOLUTION, SOLUTION STORAGE BODY, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2023-05-04 US disclosed
US-11640113-B2 Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and method of manufacturing electronic device FUJIFILM CORPORATION (JP) 2023-05-02 US disclosed
US-11561471-B2 Photoresist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-01-24 US disclosed
US-20180217503-A1 TREATMENT LIQUID AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2018-08-02 US disclosed
US-20180217499-A1 TREATMENT LIQUID AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2018-08-02 US disclosed
US-20180210339-A1 RESIST COMPOSITION, AND RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE, EACH USING RESIST COMPOSITION FUJIFILM CORPORATION (JP) 2018-07-26 US disclosed
US-20180120708-A1 RINSING LIQUID, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20170168393-A1 PHOTORESIST COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2017-06-15 US disclosed
US-20170121437-A1 PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND MASK BLANK FUJIFILM CORPORATION (JP) 2017-05-04 US disclosed
US-20160195814-A1 PATTERN FORMATION METHOD, ELECTRONIC-DEVICE PRODUCTION METHOD, AND PROCESSING AGENT FUJIFILM CORPORATION (JP) 2016-07-07 US disclosed
US-20150086912-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND PATTERN FORMING METHOD USING THE SAME, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2015-03-26 US disclosed