SCHEMBL16615639

SCHEMBL16615639

O=C1C=CC(=O)N1c1ccc(Cc2ccc(N3C(=O)CC(Nc4ccc(Cc5ccc(NC6CC(=O)N(c7ccc(Cc8ccc(N9C(=O)C=CC9=O)cc8)cc7)C6=O)cc5)cc4)C3=O)cc2)cc1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 10/20 0.63
HTT P42858 2/20 0.55
FAAH O00519 1/20 0.55
MGLL Q99685 1/20 0.55
MEN1 O00255 3/20 0.54
KMT2A Q03164 3/20 0.54
ALDH1A1 P00352 10/20 0.53
GAA P10253 8/20 0.53
ALOX12 P18054 2/20 0.53
SPHK2 Q9NRA0 1/20 0.53
SPHK1 Q9NYA1 1/20 0.53
KDM4E B2RXH2 1/20 0.52
CYP2C9 P11712 1/20 0.52
CYP2C19 P33261 1/20 0.52
SMN1; SMN2 Q16637 3/20 0.45
TSHR P16473 1/20 0.45
MAPK1 P28482 1/20 0.44
GFER P55789 1/20 0.44
POLB P06746 1/20 0.43
ALOX15 P16050 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13040960 0.94 GAA (0.59) MAPTHTTFAAHMGLLMEN1
SCHEMBL13040961 0.87 GAA (0.65) MAPTHTTMEN1KMT2AALDH1A1
SCHEMBL14159537 0.87 MAPT (0.84) MAPTHTTMEN1KMT2AALDH1A1
SCHEMBL18538548 0.86 MGLL (0.58) MAPTHTTFAAHMGLLMEN1
SCHEMBL26050574 0.85 HTT (0.49) MAPTHTTFAAHMGLLMEN1
SCHEMBL14159540 0.78 MGLL (0.62) MAPTFAAHMGLLMEN1KMT2A
SCHEMBL26050589 0.78 HTT (0.54) MAPTHTTMEN1KMT2AALDH1A1
SCHEMBL23489481 0.76 MGLL (0.58) MAPTHTTFAAHMGLLMEN1
SCHEMBL16675654 0.75 MGLL (0.57) FAAHMGLLALDH1A1GAAALOX12
SCHEMBL114168 0.74 MGLL (1.00) FAAHMGLLALDH1A1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9449938-B2 Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof Henkel IP & Holding GmbH (DE) 2016-09-20 US disclosed
US-9449938-B2 Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof Henkel IP & Holding GmbH (DE) 2016-09-20 US disclosed
US-20160148894-A1 CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF HENKEL AG & CO. KGAA (DE) 2016-05-26 US disclosed
US-20160148894-A1 CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF HENKEL AG & CO. KGAA (DE) 2016-05-26 US disclosed
WO-2015048621-A1 CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF Henkel IP & Holding GmbH (DE) 2015-04-02 WO disclosed