SCHEMBL1673995

SCHEMBL1673995

CC(C)(c1ccccc1)c1ccccc1OC(=O)Oc1ccccc1C(C)(C)c1ccccc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 3/20 0.47
ATM Q13315 1/20 0.47
KDM4E B2RXH2 6/20 0.42
HPGD P15428 2/20 0.42
HSD17B10 Q99714 2/20 0.42
ALDH1A1 P00352 6/20 0.41
ESR1 P03372 2/20 0.41
CYP3A4 P08684 1/20 0.41
ESR2 Q92731 1/20 0.41
MAPT P10636 2/20 0.40
KMT2A Q03164 2/20 0.40
BCHE P06276 1/20 0.39
KCNN4 O15554 1/20 0.39
CYP2C19 P33261 1/20 0.39
HIF1A Q16665 1/20 0.39
ELANE P08246 2/20 0.39
ALOX15 P16050 1/20 0.38
HDAC3 O15379 1/20 0.38
HDAC4 P56524 1/20 0.38
HDAC1 Q13547 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL247688 0.94 ATM (0.43) TDP1ATMKDM4EHPGDHSD17B10
SCHEMBL1673996 0.89 TDP1 (0.47) TDP1ATMKDM4EHPGDHSD17B10
SCHEMBL2335330 0.88 PTGS2 (0.51) TDP1ATMKDM4EHPGDHSD17B10
SCHEMBL5706116 0.87 SLC6A3 (0.55) ATMKDM4EHPGDHSD17B10MAPT
SCHEMBL247099 0.87 TDP1 (0.40) TDP1ATMKDM4EHPGDHSD17B10
SCHEMBL1156860 0.87 ATM (0.40) TDP1ATMKDM4EHPGDHSD17B10
SCHEMBL7107069 0.86 TDP1 (0.45) TDP1ATMKDM4EALDH1A1ESR1
SCHEMBL1192182 0.85 MAPT (0.53) TDP1ATMHSD17B10ALDH1A1ESR1
SCHEMBL5705983 0.84 TSHR (0.49) TDP1KDM4EHPGDHSD17B10ALDH1A1
SCHEMBL10537603 0.83 TDP1 (0.54) TDP1ATMKDM4EHPGDHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109153776-B Copolycarbonate as support material in 3D printing 科思创德国股份有限公司 2021-03-12 CN disclosed
US-10323145-B2 Copolycarbonate compositions with cyclic and linear oligomers and improved optical properties COVESTRO DEUTSCHLAND AG (DE) 2019-06-18 US disclosed
US-20190143582-A1 COPOLYCARBONATE AS A SUPPORTING MATERIAL IN 3-D PRINTING COVESTRO DEUTSCHLAND AG (DE) 2019-05-16 US disclosed
US-20180179378-A1 Copolycarbonate Compositions with Cyclic and Linear Oligomers and Improved Optical Properties COVESTRO DEUTSCHLAND AG (DE) 2018-06-28 US disclosed
US-9969879-B2 Copolycarbonate compositions with branch structures and linear oligomers and improved rheological properties COVESTRO DEUTSCHLAND AG (DE) 2018-05-15 US disclosed
US-20170362431-A1 COPOLYCARBONATE COMPOSITIONS WITH IMPROVED RHEOLOGICAL AND OPTICAL PROPERTIES CONTAINING DIGLYCEROLESTERS COVESTRO DEUTSCHLAND AG (DE) 2017-12-21 US disclosed
US-20170355817-A1 COPOLYCARBONATE COMPOSITIONS WITH IMPROVED PROCESSING BEHAVIOUR CONTAINING PE-WAX COVESTRO DEUTSCHLAND AG (DE) 2017-12-14 US disclosed
US-20170233571-A1 Copolycarbonate Compositions with Branch Structures and Cyclic Oligomers and Improved Rheological Properties COVESTRO DEUTSCHLAND AG (DE) 2017-08-17 US disclosed
US-20170226340-A1 Copolycarbonate Compositions with Branch Structures and Linear Oligomers and Improved Rheological Properties COVESTRO DEUTSCHLAND AG (DE) 2017-08-10 US disclosed
US-20170218197-A1 COPOLYCARBONATE COMPOSITIONS WITH CYCLIC AND LINEAR OLIGOMERS AND IMPROVED RHEOLOGICAL PROPERTIES COVESTRO DEUTSCHLAND AG (DE) 2017-08-03 US disclosed
WO-2012085112-A1 POLYCARBONATE COMPOSITIONS WITH IMPROVED FLAME RESISTANCE BAYER MATERIALSCIENCE AG (DE) 2012-06-28 WO disclosed
EP-2468820-A1 Polycarbonate compositions with improved flame resistance Bayer MaterialScience AG (DE) 2012-06-27 EP disclosed
US-20110098386-A1 PRODUCTS HAVING IMPROVED FLAME RESISTANCE BAYER MATERIALSCIENCE AG (DE) 2011-04-28 US disclosed
EP-1358246-A2 MELT POLYCARBONATE CATALYST SYSTEMS GENERAL ELECTRIC COMPANY (US) 2003-11-05 EP disclosed
WO-2002055583-A2 MELT POLYCARBONATE CATALYST SYSTEMS GENERAL ELECTRIC COMPANY (US) 2002-07-18 WO disclosed