SCHEMBL16807395

SCHEMBL16807395

C=C(C)C(=O)OC(CC)(CC)C1CC2CCC1C2

nearest known ligand 0.35

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 1/20 0.35
GRM1 Q13255 1/20 0.32
HSD11B1 P28845 1/20 0.31
ALDH1A1 P00352 2/20 0.31
NPC1 O15118 1/20 0.31
MAPT P10636 1/20 0.31
HPGD P15428 1/20 0.31
MAPK1 P28482 1/20 0.31
RAB9A P51151 1/20 0.31
GFER P55789 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
POLB P06746 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10234507 0.85 EPHX2 (0.38) EPHX2GRM1HSD11B1ALDH1A1NPC1
SCHEMBL16807396 0.84 EPHX2 (0.34) EPHX2HSD11B1ALDH1A1NPC1MAPT
SCHEMBL6367599 0.81 EPHX2 (0.35) EPHX2GRM1HSD11B1ALDH1A1NPC1
SCHEMBL677843 0.81 EPHX2 (0.31) EPHX2ALDH1A1
SCHEMBL14838719 0.81 EPHX2 (0.37) EPHX2GRM1HSD11B1ALDH1A1NPC1
SCHEMBL25802902 0.81 SLC6A3 (0.31) EPHX2ALDH1A1
SCHEMBL15082318 0.81 EPHX2 (0.40) EPHX2GRM1HSD11B1ALDH1A1NPC1
SCHEMBL1819178 0.81 SLC6A3 (0.31) EPHX2ALDH1A1
SCHEMBL23365371 0.79 EPHX2 (0.34) EPHX2GRM1HSD11B1ALDH1A1NPC1
SCHEMBL20215442 0.79 EPHX2 (0.34) EPHX2GRM1HSD11B1ALDH1A1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9261785-B2 Polymer compound, resin composition for photoresists, and method for producing semiconductor DAICEL CORPORATION (JP) 2016-02-16 US disclosed
US-9261785-B2 Polymer compound, resin composition for photoresists, and method for producing semiconductor DAICEL CORPORATION (JP) 2016-02-16 US disclosed
US-20150168831-A1 POLYMER COMPOUND, RESIN COMPOSITION FOR PHOTORESISTS, AND METHOD FOR PRODUCING SEMICONDUCTOR DAICEL CORPORATION (JP) 2015-06-18 US disclosed
US-20150168831-A1 POLYMER COMPOUND, RESIN COMPOSITION FOR PHOTORESISTS, AND METHOD FOR PRODUCING SEMICONDUCTOR DAICEL CORPORATION (JP) 2015-06-18 US disclosed