SCHEMBL16807396

SCHEMBL16807396

C=C(C)C(=O)OC(C)(CC)C1CC2CCC1C2

nearest known ligand 0.34

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 1/20 0.34
HSD11B1 P28845 1/20 0.33
NPC1 O15118 1/20 0.30
ALDH1A1 P00352 1/20 0.30
MAPT P10636 1/20 0.30
HPGD P15428 1/20 0.30
MAPK1 P28482 1/20 0.30
RAB9A P51151 1/20 0.30
GFER P55789 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8557137 0.85 EPHX2 (0.37) EPHX2HSD11B1NPC1ALDH1A1MAPT
SCHEMBL16807395 0.84 EPHX2 (0.35) EPHX2HSD11B1NPC1ALDH1A1MAPT
SCHEMBL25802902 0.82 SLC6A3 (0.31) EPHX2ALDH1A1
SCHEMBL1819178 0.82 SLC6A3 (0.31) EPHX2ALDH1A1
SCHEMBL677843 0.82 EPHX2 (0.31) EPHX2ALDH1A1
SCHEMBL19497269 0.81 EPHX2 (0.36) EPHX2HSD11B1NPC1ALDH1A1MAPT
SCHEMBL14838554 0.81 EPHX2 (0.39) EPHX2HSD11B1NPC1ALDH1A1MAPT
SCHEMBL6367094 0.81 EPHX2 (0.36) EPHX2HSD11B1NPC1ALDH1A1MAPT
SCHEMBL9608690 0.79 EPHX2 (0.37) EPHX2HSD11B1NPC1ALDH1A1MAPT
SCHEMBL14984183 0.78 ALDH1A1 (0.32) EPHX2HSD11B1ALDH1A1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9261785-B2 Polymer compound, resin composition for photoresists, and method for producing semiconductor DAICEL CORPORATION (JP) 2016-02-16 US disclosed
US-9261785-B2 Polymer compound, resin composition for photoresists, and method for producing semiconductor DAICEL CORPORATION (JP) 2016-02-16 US disclosed
US-20150168831-A1 POLYMER COMPOUND, RESIN COMPOSITION FOR PHOTORESISTS, AND METHOD FOR PRODUCING SEMICONDUCTOR DAICEL CORPORATION (JP) 2015-06-18 US disclosed
US-20150168831-A1 POLYMER COMPOUND, RESIN COMPOSITION FOR PHOTORESISTS, AND METHOD FOR PRODUCING SEMICONDUCTOR DAICEL CORPORATION (JP) 2015-06-18 US disclosed