Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 4/20 | 0.55 |
| ▸ | ESR2 | Q92731 | 4/20 | 0.55 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.55 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.55 |
| ▸ | CA3 | P07451 | 2/20 | 0.55 |
| ▸ | CA6 | P23280 | 2/20 | 0.55 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.55 |
| ▸ | ESRRG | P62508 | 2/20 | 0.55 |
| ▸ | TSHR | P16473 | 2/20 | 0.55 |
| ▸ | AR | P10275 | 1/20 | 0.55 |
| ▸ | HPGD | P15428 | 1/20 | 0.55 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.55 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.55 |
| ▸ | HTR6 | P50406 | 1/20 | 0.55 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.55 |
| ▸ | CA12 | O43570 | 1/20 | 0.55 |
| ▸ | CA1 | P00915 | 1/20 | 0.55 |
| ▸ | CA2 | P00918 | 1/20 | 0.55 |
| ▸ | TYR | P14679 | 1/20 | 0.55 |
| ▸ | DRD1 | P21728 | 1/20 | 0.55 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9003755 | 0.93 | SRD5A2 (0.55) | ESRRGTSHRALDH1A1SRD5A2RXRA | |
| Bisphenol A SCHEMBL3155552 | 0.92 | ESR1 (0.47) | ESR1ESR2CYP3A4HSD17B10CA3 | |
| SCHEMBL4348947 | 0.91 | ESR1 (0.67) | ESR1ESR2CYP3A4HSD17B10CA3 | |
| Bisphenol A SCHEMBL2854094 | 0.91 | ESR1 (0.67) | ESR1ESR2CYP3A4HSD17B10CA3 | |
| Bisphenol A SCHEMBL11427584 | 0.89 | ESR1 (0.64) | ESR1ESR2CYP3A4HSD17B10CA3 | |
| Terephthalic Acid SCHEMBL31416074 | 0.85 | CA3 (0.76) | ESR1ESR2CYP3A4HSD17B10CA3 | |
| SCHEMBL134579 | 0.85 | ESR1 (0.76) | ESR1ESR2CYP3A4HSD17B10CA3 | |
| Aminobenzoic Acid SCHEMBL11378046 | 0.85 | CA3 (0.76) | ESR1ESR2CYP3A4HSD17B10CA3 | |
| Bisphenol A SCHEMBL5935233 | 0.84 | ESR1 (0.70) | ESR1ESR2CYP3A4HSD17B10CA3 | |
| SCHEMBL71433 | 0.83 | SRD5A2 (0.65) | ESR1ESR2CYP3A4HSD17B10CA3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2204484-B1 | POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, HEAT INSULATION MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT-RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT-RESISTANT BAG FILTER | KANEKA CORP (JP) | 2019-05-15 | — | — | EP | disclosed |
| US-10292262-B2 | Reinforcing-plate-integrated flexible printed circuit board | KANEKA CORPORATION (JP) | 2019-05-14 | — | — | US | disclosed |
| US-10045433-B2 | Conductive-layer-integrated flexible printed circuit board | KANEKA CORPORATION (JP) | 2018-08-07 | — | — | US | disclosed |
| US-9957390-B2 | Resin composition for pigment-containing insulating film, and use thereof | KANEKA CORPORATION (JP) | 2018-05-01 | — | — | US | disclosed |
| US-9835942-B2 | Photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2017-12-05 | — | — | US | disclosed |
| US-20170290141-A1 | CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD | KANEKA CORPORATION | 2017-10-05 | — | — | US | disclosed |
| US-9723708-B2 | Conductive-layer-integrated flexible printed circuit board | KANEKA CORPORATION (JP) | 2017-08-01 | — | — | US | disclosed |
| US-9617669-B2 | Method of making polyimide fiber assembly | KANEKA CORPORATION (JP) | 2017-04-11 | — | — | US | disclosed |
| US-9332653-B2 | Resin composition for insulating film, and use thereof | KANEKA CORPORATION (JP) | 2016-05-03 | — | — | US | disclosed |
| US-9267004-B2 | Polyimide precursor composition and use thereof | KANEKA CORPORATION (JP) | 2016-02-23 | — | — | US | disclosed |
| US-20140054081-A1 | NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER | KANEKA CORPORATION (JP) | 2014-02-27 | — | — | US | disclosed |
| US-20140048314-A1 | FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH REINFORCING PLATE | KANEKA CORPORATION (JP) | 2014-02-20 | — | — | US | disclosed |
| US-20130264099-A1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF | KANEKA CORPORATION (JP) | 2013-10-10 | — | — | US | disclosed |
| US-20130189624-A1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITION PRODUCTION KIT, AND USE THEREOF | KANEKA CORPORATION (JP) | 2013-07-25 | — | — | US | disclosed |
| US-20110083884-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF | KANEKA CORPORATION (JP) | 2011-04-14 | — | — | US | disclosed |
| US-20110061914-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE OF THE SAME, AND PRODUCTION METHOD OF THE SAME | KANEKA CORPORATION (JP) | 2011-03-17 | — | — | US | disclosed |
| US-20100229517-A1 | POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, THERMAL INSULATING MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT RESISTANT BAG FILTER | KANEKA CORPORATION (JP) | 2010-09-16 | — | — | US | disclosed |
| EP-2204484-A1 | POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, HEAT INSULATION MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT-RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT-RESISTANT BAG FILTER | Kaneka Corporation (JP) | 2010-07-07 | — | — | EP | disclosed |
| US-20100132989-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF | KANEKA CORPORATION (JP) | 2010-06-03 | — | — | US | disclosed |
| US-20100084171-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE THEREOF AND PRODUCTION METHOD THEREOF | KANEKA CORPORATION (JP) | 2010-04-08 | — | — | US | disclosed |