⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL532756 | 0.88 | TSHR (0.30) | — | |
| SCHEMBL3223166 | 0.81 | — | — | |
| SCHEMBL3946973 | 0.80 | — | — | |
| SCHEMBL8946581 | 0.79 | OPRM1 (0.42) | — | |
| SCHEMBL13473586 | 0.78 | — | — | |
| SCHEMBL1685493 | 0.78 | ALDH1A1 (0.37) | — | |
| SCHEMBL6545143 | 0.78 | — | — | |
| SCHEMBL28095087 | 0.78 | — | — | |
| SCHEMBL1685494 | 0.76 | OPRM1 (0.44) | — | |
| Ammonia Solution, Strong SCHEMBL8451494 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4306566-B1 | CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE | ADEKA CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12590178-B2 | Curable resin composition and method for suppressing curing shrinkage of curable resin composition | ADEKA CORPORATION (JP) | 2026-03-31 | — | — | US | disclosed |
| EP-4306567-B1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE | ADEKA CORP (JP) | 2025-06-04 | — | — | EP | disclosed |
| US-12269917-B2 | Curable resin composition | ADEKA CORPORATION (JP) | 2025-04-08 | — | — | US | disclosed |
| US-20250109240-A1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2025-04-03 | — | — | US | disclosed |
| WO-2025062839-A1 | COMPOUND, EPOXY RESIN, CURABLE COMPOSITION, MATERIAL FOR RECYCLING, CURED ARTICLE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING DECOMPOSITION PRODUCT, AND DECOMPOSITION METHOD | 株式会社ADEKA | 2025-03-27 | — | — | WO | disclosed |
| EP-4491653-A1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2025-01-15 | — | — | EP | disclosed |
| US-20250002707-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE | ADEKA CORPORATION (JP) | 2025-01-02 | — | — | US | disclosed |
| US-20240409681-A1 | CLATHRATE COMPOUND, EPOXY RESIN CURING AGENT, AND CURABLE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2024-12-12 | — | — | US | disclosed |
| US-20240399747-A1 | FLUID EJECTION HEAD, METHOD FOR PRODUCING FLUID EJECTION HEAD, FLUID EJECTION ASSEMBLY, AND FLUID EJECTION DEVICE | RICOH COMPANY, LTD. (JP) | 2024-12-05 | — | — | US | disclosed |
| US-20220289973-A1 | CURABLE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2022-09-15 | — | — | US | disclosed |
| WO-2022190745-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE | 株式会社ADEKA | 2022-09-15 | — | — | WO | disclosed |
| WO-2022168666-A1 | CURABLE RESIN COMPOSITION | 株式会社ADEKA | 2022-08-11 | — | — | WO | disclosed |
| WO-2022168665-A1 | NOVEL COMPOUND, AND CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND | 株式会社ADEKA | 2022-08-11 | — | — | WO | disclosed |
| WO-2022168670-A1 | CHARGE TRANSFER COMPLEX | 株式会社ADEKA | 2022-08-11 | — | — | WO | disclosed |
| EP-4029896-A1 | CURABLE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2022-07-20 | — | — | EP | disclosed |
| US-20220185946-A1 | CURABLE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2022-06-16 | — | — | US | disclosed |
| EP-3950761-A1 | CURABLE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2022-02-09 | — | — | EP | disclosed |
| US-8911586-B2 | One liquid type cyanate-epoxy composite resin composition | ADEKA CORPORATION (JP) | 2014-12-16 | — | — | US | disclosed |
| US-20110095453-A1 | ONE LIQUID TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2011-04-28 | — | — | US | disclosed |