SCHEMBL1685493

SCHEMBL1685493

CCCCC(CCC)N(N)N

nearest known ligand 0.37

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.37
TDP1 Q9NUW8 1/20 0.37
DNM1 Q05193 2/20 0.36
OPRM1 P35372 1/20 0.35
CA1 P00915 2/20 0.33
CA2 P00918 2/20 0.33
PLA2G1B P04054 1/20 0.31
PLA2G2A P14555 1/20 0.31
TSHR P16473 3/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
CYP3A4 P08684 1/20 0.31
FDPS P14324 1/20 0.31
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9761739 0.95 ALDH1A1 (0.40) ALDH1A1TDP1DNM1OPRM1CA1
SCHEMBL1685494 0.92 OPRM1 (0.44) DNM1OPRM1PLA2G1BPLA2G2ACYP3A4
SCHEMBL6579135 0.90 OPRM1 (0.42) DNM1OPRM1PLA2G1BPLA2G2ATSHR
SCHEMBL532756 0.89 TSHR (0.30) TSHR
SCHEMBL6544930 0.83
SCHEMBL10972927 0.82 ALDH1A1 (0.46) ALDH1A1TDP1DNM1OPRM1CA1
SCHEMBL6545348 0.80 PLA2G1B (0.34) DNM1PLA2G1BPLA2G2A
SCHEMBL1685442 0.78
SCHEMBL6544840 0.77
SCHEMBL3946973 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4306566-B1 CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE ADEKA CORP (JP) 2026-05-06 EP disclosed
US-12590178-B2 Curable resin composition and method for suppressing curing shrinkage of curable resin composition ADEKA CORPORATION (JP) 2026-03-31 US disclosed
EP-4306567-B1 CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE ADEKA CORP (JP) 2025-06-04 EP disclosed
US-12269917-B2 Curable resin composition ADEKA CORPORATION (JP) 2025-04-08 US disclosed
US-20250109324-A1 CURING AGENT FOR EPOXY RESIN, AND ADHESIVE SUNSTAR ENGINEERING INC. (JP) 2025-04-03 US disclosed
US-20250109240-A1 ONE-PACK TYPE EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2025-04-03 US disclosed
WO-2025062839-A1 COMPOUND, EPOXY RESIN, CURABLE COMPOSITION, MATERIAL FOR RECYCLING, CURED ARTICLE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING DECOMPOSITION PRODUCT, AND DECOMPOSITION METHOD 株式会社ADEKA 2025-03-27 WO disclosed
WO-2025047655-A1 BLOCK URETHANE MATERIAL, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND BLOCK URETHANE COMPOUND CONTAINED THEREIN 株式会社ADEKA 2025-03-06 WO disclosed
EP-4491653-A1 ONE-PACK TYPE EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2025-01-15 EP disclosed
US-20250002707-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE ADEKA CORPORATION (JP) 2025-01-02 US disclosed
US-20220403099-A1 CURABLE COMPOSITION, CURED PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE, AND METHOD FOR MANUFACTURING SAME DIC CORPORATION (JP) 2022-12-22 US disclosed
EP-4059978-A1 CURABLE COMPOSITION, CURED OBJECT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE AND PRODUCTION METHOD THEREFOR DIC Corporation (JP) 2022-09-21 EP disclosed
WO-2022190745-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE 株式会社ADEKA 2022-09-15 WO disclosed
US-20220289973-A1 CURABLE RESIN COMPOSITION ADEKA CORPORATION (JP) 2022-09-15 US disclosed
WO-2022190746-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE 株式会社ADEKA 2022-09-15 WO disclosed
EP-4029896-A1 CURABLE RESIN COMPOSITION ADEKA CORPORATION (JP) 2022-07-20 EP disclosed
US-20220185946-A1 CURABLE RESIN COMPOSITION ADEKA CORPORATION (JP) 2022-06-16 US disclosed
EP-3950761-A1 CURABLE RESIN COMPOSITION ADEKA CORPORATION (JP) 2022-02-09 EP disclosed
US-8911586-B2 One liquid type cyanate-epoxy composite resin composition ADEKA CORPORATION (JP) 2014-12-16 US disclosed
US-20110095453-A1 ONE LIQUID TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION ADEKA CORPORATION (JP) 2011-04-28 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12590178-B2 Curable resin composition and method for suppressing curing shrinkage of curable resin composition SEM1, RER1, JMJD6 ALDH1A1 1138/4885TDP1 1939/4885DNM1 4167/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.