SCHEMBL1685458

SCHEMBL1685458

NCCN1CCCCC1.NCCN1CCOCC1

nearest known ligand 0.61

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
KEAP1 Q14145 1/20 0.61
SMN1; SMN2 Q16637 1/20 0.61
ALOX15 P16050 1/20 0.52
KDM4E B2RXH2 2/20 0.45
ALDH1A1 P00352 1/20 0.45
HRH3 Q9Y5N1 8/20 0.44
GLA P06280 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.39
CYP1A2 P05177 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22840596 0.93 SMN1; SMN2 (0.59) KEAP1SMN1; SMN2ALOX15KDM4EALDH1A1
SCHEMBL2244319 0.91 SMN1; SMN2 (0.61) KEAP1SMN1; SMN2ALOX15KDM4EALDH1A1
SCHEMBL9444 0.91
Hydrochloric Acid SCHEMBL1168021 0.88 KEAP1 (0.70) KEAP1SMN1; SMN2ALOX15KDM4EALDH1A1
Ammonia Solution, Strong SCHEMBL726007 0.88 KEAP1 (0.70) KEAP1SMN1; SMN2ALOX15KDM4EALDH1A1
SCHEMBL10917755 0.88 KEAP1 (0.70) KEAP1SMN1; SMN2ALOX15KDM4EALDH1A1
Hydrochloric Acid SCHEMBL8859956 0.88 KEAP1 (0.70) KEAP1SMN1; SMN2ALOX15KDM4EALDH1A1
SCHEMBL1307205 0.88 KEAP1 (0.70) KEAP1SMN1; SMN2ALOX15KDM4EALDH1A1
SCHEMBL27350451 0.88 KEAP1 (0.70) KEAP1SMN1; SMN2ALOX15KDM4EALDH1A1
SCHEMBL12937 0.88 ALDH1A1 (0.54) KEAP1SMN1; SMN2KDM4EALDH1A1HRH3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8911586-B2 One liquid type cyanate-epoxy composite resin composition ADEKA CORPORATION (JP) 2014-12-16 US disclosed
US-20110095453-A1 ONE LIQUID TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION ADEKA CORPORATION (JP) 2011-04-28 US disclosed
US-5744504-A AMINO RESIN; THERMOSETTING MOLDING MATERIALS MITSUI TOATSU CHEMICALS, INC. (JP) 1998-04-28 US disclosed