SCHEMBL1685754

SCHEMBL1685754

C=C(C)C(=O)OCC(O)c1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.50
HPGD P15428 1/20 0.46
LMNA P02545 2/20 0.44
SMN1; SMN2 Q16637 4/20 0.41
CYP1A2 P05177 1/20 0.41
CYP2D6 P10635 1/20 0.41
PKM P14618 1/20 0.41
NPSR1 Q6W5P4 1/20 0.41
KMT2A Q03164 1/20 0.41
ELANE P08246 1/20 0.41
NPC1 O15118 3/20 0.40
RAB9A P51151 3/20 0.40
BCAT2 O15382 1/20 0.40
POLB P06746 1/20 0.39
APEX1 P27695 1/20 0.39
HTT P42858 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
ALDH1A1 P00352 3/20 0.39
CYP3A4 P08684 1/20 0.39
KDM4E B2RXH2 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3180135 0.86 TSHR (0.53) TSHRHPGDSMN1; SMN2CYP1A2CYP2D6
SCHEMBL10531702 0.85 TSHR (0.49) TSHRLMNASMN1; SMN2POLBAPEX1
SCHEMBL16232460 0.84 TSHR (0.51) TSHRNPSR1KMT2ANPC1POLB
SCHEMBL13801021 0.84 HPGD (0.44) TSHRHPGDLMNASMN1; SMN2KMT2A
SCHEMBL296808 0.83 TSHR (0.55) TSHRHPGDSMN1; SMN2CYP1A2CYP2D6
SCHEMBL13801022 0.83 POLB (0.49) TSHRHPGDLMNASMN1; SMN2NPC1
SCHEMBL10362252 0.82 ALDH1A1 (0.50) HPGDLMNASMN1; SMN2CYP1A2CYP2D6
SCHEMBL5566856 0.82 ALDH1A1 (0.50) HPGDLMNASMN1; SMN2CYP1A2CYP2D6
SCHEMBL9446174 0.82 LMNA (0.43) HPGDLMNASMN1; SMN2CYP1A2CYP2D6
SCHEMBL9579874 0.82 TSHR (0.49) TSHRHPGDSMN1; SMN2CYP1A2CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116736635-B Photosensitive resin composition, adhesive polymer, monomer, element, resist pattern manufacturing method, and printed wiring manufacturing method 珦盛新材料(珠海)有限公司 2024-04-19 CN claimed
CN-116736635-A Photosensitive resin composition, adhesive polymer, monomer, element, resist pattern manufacturing method, and printed wiring manufacturing method 珦盛新材料(珠海)有限公司 2023-09-12 CN claimed
US-3993684-A PHOTOSENSITIVE ACRYLIC ESTER POLYMERS WESTERN LITHO PLATE & SUPPLY CO. (US) 1976-11-23 US claimed
CN-116736635-B Photosensitive resin composition, adhesive polymer, monomer, element, resist pattern manufacturing method, and printed wiring manufacturing method 珦盛新材料(珠海)有限公司 2024-04-19 CN disclosed
CN-116736635-A Photosensitive resin composition, adhesive polymer, monomer, element, resist pattern manufacturing method, and printed wiring manufacturing method 珦盛新材料(珠海)有限公司 2023-09-12 CN disclosed
US-20210223690-A1 PHOTOCURABLE COMPOSITION FOR IMPRINT, METHOD FOR PRODUCING FILM USING THE SAME, METHOD FOR PRODUCING OPTICAL COMPONENT USING THE SAME, METHOD FOR PRODUCING CIRCUIT BOARD USING THE SAME, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING THE SAME CANON KK (JP) 2021-07-22 US disclosed
US-11037785-B2 Method for fabricating pattern of cured product and methods for manufacturing optical component, circuit board and quartz mold replica as well as coating material for imprint pretreatment and cured product thereof CANON KABUSHIKI KAISHA (JP) 2021-06-15 US disclosed
US-11003073-B2 Photocurable composition for imprint, method for producing film using the same, method for producing optical component using the same, method for producing circuit board using the same, and method for producing electronic component using the same CANON KABUSHIKI KAISHA (JP) 2021-05-11 US disclosed
US-20170351172-A1 PHOTOCURABLE COMPOSITION FOR IMPRINT, METHOD FOR PRODUCING FILM USING THE SAME, METHOD FOR PRODUCING OPTICAL COMPONENT USING THE SAME, METHOD FOR PRODUCING CIRCUIT BOARD USING THE SAME, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING THE SAME CANON KABUSHIKI KAISHA (JP) 2017-12-07 US disclosed
US-9040636-B2 Hydroxy ester resins DOW GLOBAL TECHNOLOGIES LLC (US) 2015-05-26 US disclosed
US-20140316099-A1 HYDROXY ESTER RESINS BLUE CUBE IP LLC 2014-10-23 US disclosed
US-5859722-A Electrochromic device NIPPOM OIL CO., LTD (JP) 1999-01-12 US disclosed
EP-0752612-A1 Electrochromic device NIPPON OIL CO., LTD. (JP) 1997-01-08 EP disclosed
US-5326821-A Resin composition for powder coatings UNITIKA LTD. (JP) 1994-07-05 US disclosed
EP-0314447-B1 Process for producing a resin composition for powder coatings. UNITIKA LTD. (JP) 1993-08-25 EP disclosed
US-4876311-A Opaque synthetic resins ROHM GMBH CHEMISCHE FABRIK (DE) 1989-10-24 US disclosed
EP-0314447-A2 Process for producing a resin composition for powder coatings. UNITIKA LTD. (JP) 1989-05-03 EP disclosed
EP-0106047-B1 OLEFINICALLY UNSATURATED SILOXANES, PROCESS FOR THEIR PREPARATION AND THEIR USE AS REACTIVE DILUENTS IN RADICALLY CROSS-LINKABLE LACQUERING SYSTEMS BAYER AG (DE) 1985-10-23 EP disclosed
EP-0106047-A1 Olefinically unsaturated siloxanes, process for their preparation and their use as reactive diluents in radically cross-linkable lacquering systems BAYER AG (DE) 1984-04-25 EP disclosed
US-3993684-A PHOTOSENSITIVE ACRYLIC ESTER POLYMERS WESTERN LITHO PLATE & SUPPLY CO. (US) 1976-11-23 US disclosed