SCHEMBL1686889

SCHEMBL1686889

Cc1ccc([Si](O)(O)c2ccc(C)cc2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACHE P22303 6/20 0.50
TDP1 Q9NUW8 1/20 0.50
ALDH1A1 P00352 6/20 0.39
LMNA P02545 3/20 0.39
CA2 P00918 2/20 0.39
CES2 O00748 1/20 0.39
CES1 P23141 1/20 0.39
CYP2A6 P11509 1/20 0.39
LPL P06858 1/20 0.39
LIPG Q9Y5X9 1/20 0.39
ORAI1 Q96D31 1/20 0.39
ORAI2 Q96SN7 1/20 0.39
ORAI3 Q9BRQ5 1/20 0.39
TRPV6 Q9H1D0 1/20 0.39
CA1 P00915 1/20 0.38
CA7 P43166 1/20 0.38
CA9 Q16790 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
TSHR P16473 4/20 0.36
NOS3 P29474 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8575046 0.89 ACHE (0.48) ACHETDP1ALDH1A1LMNACES2
SCHEMBL7862066 0.81 ACHE (0.50) ACHETDP1ALDH1A1LMNACA2
SCHEMBL1686464 0.81 ACHE (0.50) ACHETDP1ALDH1A1LMNACA2
Toluene SCHEMBL27693706 0.80 ACHE (0.58) ACHETDP1ALDH1A1LMNACES2
SCHEMBL3482615 0.79 ACHE (0.47) ACHETDP1ALDH1A1LMNACA2
SCHEMBL15445504 0.79 ACHE (0.47) ACHETDP1ALDH1A1LMNACA2
SCHEMBL1054613 0.78 ACHE (0.53) ACHETDP1ALDH1A1LMNACA2
SCHEMBL4073452 0.73 ACHE (0.57) ACHETDP1ALDH1A1LMNACA2
SCHEMBL13231686 0.73 ACHE (0.57) ACHETDP1ALDH1A1LMNACA2
SCHEMBL12910408 0.73 ACHE (0.40) ACHETDP1ALDH1A1LMNACA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260085145-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED ARTICLE DAINIPPON INK & CHEMICALS (JP) 2026-03-26 US disclosed
EP-4628517-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED ARTICLE DIC Corporation (JP) 2025-10-08 EP disclosed
WO-2025070077-A1 CURABLE RESIN COMPOSITION, CURED ARTICLE, AND OPTICAL WAVEGUIDE DIC株式会社 2025-04-03 WO disclosed
CN-113166343-B Reactive silicone composition and cured product thereof 日产化学株式会社 2025-03-18 CN disclosed
US-12129409-B2 Reactive silicone composition and cured product thereof NISSAN CHEMICAL CORPORATION (JP) 2024-10-29 US disclosed
CN-117859098-A Photosensitive resin composition and microlens 东丽株式会社 2024-04-09 CN disclosed
WO-2023054226-A1 PHOTOSENSITIVE RESIN COMPOSITION, MICROLENS 東レ株式会社 2023-04-06 WO disclosed
CN-115268214-A Radiation-sensitive composition, cured film and method for producing the same, semiconductor and display device JSR株式会社 2022-11-01 CN disclosed
US-20220010176-A1 REACTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF NISSAN CHEMICAL CORPORATION (JP) 2022-01-13 US disclosed
EP-3885381-A1 REACTIVE SILICONE COMPOSITION AND CURED PRODUCT OF SAME Nissan Chemical Corporation (JP) 2021-09-29 EP disclosed
US-20040209762-A1 Metal compound, and catalyst component and catalyst for addition polymerization, and process for producing addition polymer SUMITOMO CHEMICAL COMPANY, LIMITED 2004-10-21 US disclosed
EP-0799858-B1 Ultraviolet-curable composition and method for forming cured-product patterns therefrom DOW CORNING ASIA LTD (JP) 2003-09-24 EP disclosed
EP-0725106-B1 Radiation curable compositions DOW CORNING ASIA LTD (JP) 1999-11-03 EP disclosed
US-5891529-A Radiation curable sompositions DOW CORNING ASIA, LTD. (JP) 1999-04-06 US disclosed
US-5820944-A Ultraviolet-curable composition and method for forming cured-product patterns therefrom DOW CORNING ASIA, LTD. (JP) 1998-10-13 US disclosed
US-5789460-A Radiation curable compositions DOW CORNING ASIA, LTD. (JP) 1998-08-04 US disclosed
EP-0799858-A1 Ultraviolet-curable composition and method for forming cured-product patterns therefrom DOW CORNING ASIA, Ltd. (JP) 1997-10-08 EP disclosed
EP-0798341-A1 Radiation-curable composition and method for manufacturing cured-product patterns therefrom DOW CORNING ASIA, Ltd. (JP) 1997-10-01 EP disclosed
EP-0725106-A2 Radiation curable compositions DOW CORNING ASIA, Ltd. (JP) 1996-08-07 EP disclosed
US-4525557-A FROM REACTION PRODUCT OF A SILANOL AND A DIALKYL MAGNESIUM COMPOUND GULF OIL CORPORATION (US) 1985-06-25 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260085145-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED ARTICLE MAT1A, CAPZA1, CDH1 ACHE 3117/4885TDP1 2706/4885ALDH1A1 376/4885
US-20040209762-A1 Metal compound, and catalyst component and catalyst for addition polymerization, and process for producing addition polymer AP1M1, PYM1, SEM1 ACHE 4578/4885TDP1 3299/4885ALDH1A1 1378/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.