SCHEMBL1697126

SCHEMBL1697126

CNCc1cccc(CNC)c1

nearest known ligand 0.64

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.64
KDM4E B2RXH2 1/20 0.64
CYP3A4 P08684 1/20 0.64
PRMT6 Q96LA8 7/20 0.59
NOS1 P29475 4/20 0.57
EPHX2 P34913 1/20 0.55
HTR7 P34969 2/20 0.52
NOS3 P29474 2/20 0.46
MRGPRX4 Q96LA9 1/20 0.45
PARP1 P09874 1/20 0.45
ALDH1A1 P00352 1/20 0.45
LMNA P02545 1/20 0.45
PKM P14618 1/20 0.45
ALOX12 P18054 1/20 0.45
LOXL2 Q9Y4K0 1/20 0.44
NOS2 P35228 1/20 0.44
TAAR1 Q96RJ0 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL3273205 0.97 MAPT (0.68) MAPTKDM4ECYP3A4PRMT6NOS1
SCHEMBL8441355 0.91 KDM4E (0.54) MAPTKDM4ECYP3A4PRMT6NOS1
SCHEMBL30125422 0.89 NOS1 (0.53) MAPTKDM4ECYP3A4PRMT6NOS1
SCHEMBL20987907 0.89 MAPT (0.52) MAPTKDM4ECYP3A4PRMT6NOS1
SCHEMBL3363042 0.89 NOS1 (0.53) MAPTKDM4ECYP3A4PRMT6NOS1
SCHEMBL24292849 0.89 MAPT (0.52) MAPTKDM4ECYP3A4PRMT6NOS1
SCHEMBL8617312 0.89 MAPT (0.64) MAPTKDM4ECYP3A4PRMT6NOS1
SCHEMBL7026536 0.89 NOS1 (0.53) MAPTKDM4ECYP3A4PRMT6NOS1
SCHEMBL8491487 0.87 KDM4E (0.50) MAPTKDM4ECYP3A4PRMT6NOS1
SCHEMBL30028184 0.85 KDM4E (0.54) MAPTKDM4ECYP3A4PRMT6NOS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 129 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112673043-B Curing agent composition for epoxy resin mixtures, epoxy resin mixtures and multicomponent epoxy resin systems 喜利得股份公司 2024-03-29 CN claimed
US-11542391-B2 Hardener component for multi-component epoxy resin material, and multi-component epoxy resin material HILTI AKTIENGESELLSCHAFT (LI) 2023-01-03 US claimed
US-11499004-B2 Curing agent composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system HILTI AKTIENGESELLSCHAFT (LI) 2022-11-15 US claimed
CN-111247190-B Hardener component for a multi-component epoxy resin material and multi-component epoxy resin material 喜利得股份公司 2022-11-04 CN claimed
EP-3853280-B1 CURING AGENT COMPOSITION FOR AN EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION AND MULTI-COMPONENT EPOXY RESIN SYSTEM HILTI AG (LI) 2022-06-22 EP claimed
EP-3724252-B1 CURING COMPONENTS FOR MULTI-COMPONENT EPOXY RESIN MASS AND MULTI-COMPONENT EPOXY RESIN MASS HILTI AG (LI) 2022-05-25 EP claimed
US-20220033570-A1 Curing agent composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system HILTI AKTIENGESELLSCHAFT (LI) 2022-02-03 US claimed
EP-3853280-A1 CURING COMPOSITION FOR EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION, AND MULTI-COMPONENT EPOXY RESIN SYSTEM Hilti Aktiengesellschaft (LI) 2021-07-28 EP claimed
US-20200362161-A1 Hardener component for multi-component epoxy resin material, and multi-component epoxy resin material HILTI AKTIENGESELLSCHAFT (LI) 2020-11-19 US claimed
EP-3724252-A1 HARDENER COMPONENT FOR MULTI-COMPONENT EPOXY RESIN MATERIAL, AND MULTI-COMPONENT EPOXY RESIN MATERIAL Hilti Aktiengesellschaft (LI) 2020-10-21 EP claimed
EP-3498750-A1 CURING COMPONENTS FOR MULTI-COMPONENT EPOXY RESIN MASS AND MULTI-COMPONENT EPOXY RESIN MASS HILTI Aktiengesellschaft (LI) 2019-06-19 EP claimed
EP-2796443-B1 Curing agent for low temperature cure applications EVONIK DEGUSSA GMBH (DE) 2018-07-04 EP claimed
EP-2159218-B1 Curing agent for low temperature cure applications EVONIK DEGUSSA GMBH (DE) 2018-06-06 EP claimed
EP-2159215-B1 Process for preparing a curing agent for low temperature cure applications AIR PROD & CHEM (US) 2014-11-26 EP claimed
US-8512594-B2 Curing agent of N,N′-dimethyl-meta-xylylenediamine and multifunctional amin(s) AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-08-20 US claimed
US-8501997-B2 Curing agent for low temperature cure applications AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-08-06 US claimed
EP-2159218-A1 Curing agent for low temperature cure applications Air Products and Chemicals, Inc. (US) 2010-03-03 EP claimed
EP-2159215-A1 Process for preparing a curing agent for low temperature cure applications Air Products and Chemicals, Inc. (US) 2010-03-03 EP claimed
US-20100048954-A1 CURING AGENT FOR LOW TEMPERATURE CURE APPLICATIONS AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-02-25 US claimed
US-20100048827-A1 CURING AGENT FOR LOW TEMPERATURE CURE APPLICATIONS AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-02-25 US claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100048954-A1 CURING AGENT FOR LOW TEMPERATURE CURE APPLICATIONS PNMT, HNMT, KDM5B MAPT 1765/4885KDM4E 51/4885CYP3A4 2913/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.