Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MCL1 | Q07820 | 1/20 | 0.49 |
| ▸ | HPGD | P15428 | 3/20 | 0.47 |
| ▸ | GAA | P10253 | 1/20 | 0.47 |
| ▸ | FASN | P49327 | 2/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.46 |
| ▸ | HTT | P42858 | 1/20 | 0.45 |
| ▸ | NPC1 | O15118 | 1/20 | 0.44 |
| ▸ | TP53 | P04637 | 1/20 | 0.44 |
| ▸ | POLB | P06746 | 1/20 | 0.44 |
| ▸ | RAB9A | P51151 | 1/20 | 0.44 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.43 |
| ▸ | NPY2R | P49146 | 1/20 | 0.43 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.43 |
| ▸ | PKM | P14618 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27351823 | 0.95 | HPGD (0.51) | MCL1HPGDGAAFASNALDH1A1 | |
| SCHEMBL7167323 | 0.89 | MCL1 (0.46) | MCL1HPGDGAAFASNALDH1A1 | |
| SCHEMBL4566340 | 0.87 | KMO (0.50) | HPGDGAAALDH1A1HTTPOLB | |
| SCHEMBL9389800 | 0.84 | ALDH1A1 (0.54) | HPGDFASNALDH1A1NPC1TP53 | |
| SCHEMBL1129558 | 0.83 | ALDH1A1 (0.44) | HPGDALDH1A1HTTNPC1RAB9A | |
| SCHEMBL14650448 | 0.83 | HPGD (0.45) | HPGDALDH1A1HTTNPC1POLB | |
| SCHEMBL4322056 | 0.81 | KDM4E (0.47) | HPGDGAAALDH1A1HTTNPC1 | |
| SCHEMBL5479885 | 0.78 | HPGD (0.40) | HPGDGAAFASNALDH1A1HTT | |
| SCHEMBL9680888 | 0.77 | AKR1C3 (0.44) | HPGDGAAFASNALDH1A1NPC1 | |
| SCHEMBL13446994 | 0.77 | ALDH1A1 (0.49) | MCL1HPGDALDH1A1HTTTP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7153369-B2 | Method of chemical mechanical polishing | JSR CORPORATION (JP) | 2006-12-26 | — | — | US | claimed |
| US-20020005017-A1 | Polishing cycles | JSR CORPORATION (JP) | 2002-01-17 | — | — | US | claimed |
| EP-1138734-A2 | Aqueous dispersion for chemical mechanical polishing of metal films | JSR Corporation (JP) | 2001-10-04 | — | — | EP | claimed |
| US-20250189895-A1 | METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-06-12 | — | — | US | disclosed |
| US-20250172872-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-05-29 | — | — | US | disclosed |
| US-12227863-B2 | Anodizing method and manufacturing method for an anisotropic conductive member | FUJIFILM CORPORATION (JP) | 2025-02-18 | — | — | US | disclosed |
| US-20230106185-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, AND ACID DIFFUSION SUPPRESSING AGENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-06 | — | — | US | disclosed |
| WO-2022034769-A1 | STRUCTURE, STRUCTURE MANUFACTURING METHOD, BONDED BODY MANUFACTURING METHOD, AND DEVICE MANUFACTURING METHOD | 富士フイルム株式会社 | 2022-02-17 | — | — | WO | disclosed |
| WO-2022004290-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR MANUFACTURING PLATING MOLD-ATTACHED SUBSTRATE, AND METHOD FOR MANUFACTURING PLATED OBJECT | 東京応化工業株式会社 | 2022-01-06 | — | — | WO | disclosed |
| US-20210363653-A1 | ANODIZING METHOD AND MANUFACTURING METHOD FOR AN ANISOTROPIC CONDUCTIVE MEMBER | FUJIFILM CORPORATION (JP) | 2021-11-25 | — | — | US | disclosed |
| WO-2021131538-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PATTERNED RESIST FILM, METHOD FOR PRODUCING SUBSTRATE PROVIDED WITH TEMPLATE, AND METHOD FOR PRODUCING PLATED MODELED OBJECT | 東京応化工業株式会社 | 2021-07-01 | — | — | WO | disclosed |
| US-20040144755-A1 | Aqueous dispersion for chemical mechanical polishing | JSR Corporation (50%) (JP) | 2004-07-29 | — | — | US | disclosed |
| US-20020193451-A1 | Method of chemical mechanical polishing | JSR CORPORATION (JP) | 2002-12-19 | — | — | US | disclosed |
| US-20020010232-A1 | Composition for polishing pad and polishing pad using the same | JSR CORPORATION (JP) | 2002-01-24 | — | — | US | disclosed |
| US-20020005017-A1 | Polishing cycles | JSR CORPORATION (JP) | 2002-01-17 | — | — | US | disclosed |
| EP-1164559-A1 | Composition for polishing pad and polishing pad using the same | JSR Corporation (JP) | 2001-12-19 | — | — | EP | disclosed |
| US-20010049912-A1 | Aqueous dispersion for chemical mechanical polishing | JSR CORPORATION (JP) | 2001-12-13 | — | — | US | disclosed |
| EP-1138734-A2 | Aqueous dispersion for chemical mechanical polishing of metal films | JSR Corporation (JP) | 2001-10-04 | — | — | EP | disclosed |
| EP-1138733-A2 | Aqueous dispersion for chemical mechanical polishing of insulating films | JSR Corporation (JP) | 2001-10-04 | — | — | EP | disclosed |
| EP-1077240-A1 | Aqueous dispersion for chemical mechanical polishing | JSR Corporation (JP) | 2001-02-21 | — | — | EP | disclosed |