SCHEMBL16994145

SCHEMBL16994145

CCOc1ccc(OCC(=O)c2cccc(C(C)=O)c2)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ RAB9A P51151 5/20 0.56
▸ MAPT P10636 5/20 0.56
▸ ALDH1A1 P00352 3/20 0.55
▸ LMNA P02545 3/20 0.55
▸ SMN1; SMN2 Q16637 6/20 0.53
▸ KMT2A Q03164 6/20 0.53
▸ NPC1 O15118 6/20 0.53
▸ MEN1 O00255 5/20 0.53
▸ POLB P06746 1/20 0.53
▸ BLM P54132 1/20 0.53
▸ MAPK1 P28482 2/20 0.53
▸ TP53 P04637 1/20 0.50
▸ PKM P14618 1/20 0.50
▸ NFKB1 P19838 1/20 0.50
▸ NFKB2 Q00653 1/20 0.50
▸ RELA Q04206 1/20 0.50
▸ MRGPRX4 Q96LA9 1/20 0.50
▸ L3MBTL1 Q9Y468 2/20 0.49
▸ TDP1 Q9NUW8 1/20 0.49
▸ MITF O75030 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7913273 0.83 LMNA (0.61) RAB9AMAPTALDH1A1LMNASMN1; SMN2
SCHEMBL29446640 0.82 MAPT (0.69) RAB9AMAPTALDH1A1LMNASMN1; SMN2
SCHEMBL307233 0.80 KMT2A (0.75) RAB9AMAPTALDH1A1LMNASMN1; SMN2
SCHEMBL5151396 0.80 RXRA (0.60) RAB9AMAPTALDH1A1LMNASMN1; SMN2
SCHEMBL15179057 0.79 NPC1 (0.78) RAB9AMAPTALDH1A1LMNASMN1; SMN2
1,4-Diethoxybenzene SCHEMBL28832463 0.79 MAOB (0.64) RAB9AMAPTALDH1A1LMNASMN1; SMN2
SCHEMBL9787148 0.78 MAOB (0.68) RAB9AMAPTALDH1A1LMNASMN1; SMN2
SCHEMBL9787036 0.78 MAPT (0.85) RAB9AMAPTALDH1A1LMNASMN1; SMN2
SCHEMBL28116827 0.77 MAPT (0.59) RAB9AMAPTALDH1A1LMNASMN1; SMN2
SCHEMBL166144 0.76 L3MBTL1 (0.70) RAB9AMAPTALDH1A1LMNAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9107307-B2 Resin composition for printed circuit board, insulating film, prepreg, and printed circuit board SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2015-08-11 — — US disclosed
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